Goldberg; Cindy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goldberg; Cindy.The latest application filed is for "graphene capped hemt device".

Company Profile

0.9.9

Goldberg; Cindy - Cold Spring NY US
Goldberg; Cindy - Montobonnot FR
Goldberg; Cindy - Austin TX
Goldberg; Cindy - Montbonnot FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Endpoint detector for a semiconductor processing station and associated methods Grant 9,002,493 - Zhang , et al. April 7, 2	2015-04-07
Graphene capped HEMT device Grant 8,987,780 - Zhang , et al. March 24, 2	2015-03-24
Graphene Capped Hemt Device App 20140353722 - Zhang; John H. ; et al.	2014-12-04
System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections Grant 8,900,990 - Zhang , et al. December 2, 2	2014-12-02
System And Method Of Combining Damascenes And Subtract Metal Etch For Advanced Back End Of Line Interconnections App 20140183735 - ZHANG; John H. ; et al.	2014-07-03
Endpoint Detector For A Semiconductor Processing Station And Associated Methods App 20130218316 - ZHANG; John H. ; et al.	2013-08-22
Copper interconnect structure having a graphene cap Grant 8,476,765 - Zhang , et al. July 2, 2	2013-07-02
Copper Interconnect Structure Having A Graphene Cap App 20120139114 - Zhang; John Hongguang ; et al.	2012-06-07
Precise Real Time And Position Low Pressure Control Of Chemical Mechanical Polish (cmp) Head App 20120122373 - Zhang; John H. ; et al.	2012-05-17
Semiconductor wafer with low-K dielectric layer and process for fabrication thereof Grant 7,994,069 - Smith , et al. August 9, 2	2011-08-09
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor device Grant 7,951,729 - Farkas , et al. May 31, 2	2011-05-31
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device Grant 7,691,756 - Farkas , et al. April 6, 2	2010-04-06
Integrated System For Semiconductor Substrate Processing Using Liquid Phase Metal Deposition App 20090301867 - Farkas; Janos ; et al.	2009-12-10
Wafer And Method Of Forming Alignment Markers App 20090134496 - Warrick; Scott ; et al.	2009-05-28
Semiconductor Wafer With Low-K Dielectric Layer and Process For Fabrication Thereof App 20080182379 - Smith; Brad ; et al.	2008-07-31

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