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Patent applications and USPTO patent grants for Golab; James S..The latest application filed is for "multiple interconnections between die".
Patent | Date |
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Substrate dielectric crack prevention using interleaved metal plane Grant 10,537,019 - Zhou , et al. Ja | 2020-01-14 |
Methods and devices with enhanced grounding and shielding for wire bond structures Grant 10,256,193 - Golab , et al. | 2019-04-09 |
Multiple interconnections between die Grant 10,037,970 - Clegg , et al. July 31, 2 | 2018-07-31 |
Multiple Interconnections Between Die App 20180068980 - Clegg; David ;   et al. | 2018-03-08 |
Cache controller for processing simultaneous cache accesses Grant 5,598,550 - Shen , et al. January 28, 1 | 1997-01-28 |
Sense amplifier with an integral logic function Grant 5,034,636 - Reis , et al. July 23, 1 | 1991-07-23 |
Latching sense amplifier Grant 4,831,287 - Golab May 16, 1 | 1989-05-16 |
Redundant decoder Grant 4,724,422 - Golab February 9, 1 | 1988-02-09 |
Address transition pulse circuit Grant 4,614,883 - Sood , et al. September 30, 1 | 1986-09-30 |
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