gokhale shripad

Patent Applications and Registrations

Patent applications and USPTO patent grants for gokhale shripad.The latest application filed is for "microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone".

Company Profile

2.5.6

- Gilbert AZ US
GOKHALE; Shripad - Gilbert AZ
Gokhale; Shripad - Chandler AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser Ablation-based Surface Property Modification And Contamination Removal App 20210066273A1 -	2021-03-04
Microelectronics Package Comprising A Package-on-package (pop) Architecture With Inkjet Barrier Material For Controlling Bondline Thickness And Pop Adhesive Keep Out Zone App 20210066155 - NOFEN; Elizabeth ; et al.	2021-03-04
Inline measurement of molding material thickness using terahertz reflectance Grant 9,508,610 - Liu , et al. November 29, 2	2016-11-29
Inline Measurement Of Molding Material Thickness Using Terahertz Reflectance App 20160093540 - LIU; Shuhong ; et al.	2016-03-31
Reducing underfill keep out zone on substrate used in electronic device processing Grant 8,362,627 - Gokhale , et al. January 29, 2	2013-01-29
Reducing Underfill Keep Out Zone On Substrate Used In Electronic Device Processing App 20110084388 - GOKHALE; Shripad ; et al.	2011-04-14
Reducing underfill keep out zone on substrate used in electronic device processing Grant 7,875,503 - Gokhale , et al. January 25, 2	2011-01-25
Controlling substrate surface properties via colloidal coatings Grant 7,687,890 - Subramanian , et al. March 30, 2	2010-03-30
Controlling substrate surface properties via colloidal coatings App 20080237810 - Subramanian; Gopalakrishnan ; et al.	2008-10-02
Reducing Underfill Keep Out Zone On Substrate Used In Electronic Device Processing App 20080157352 - Gokhale; Shripad ; et al.	2008-07-03
Controlling flow of underfill using polymer coating and resulting devices App 20080142996 - Subramanian; Gopalakrishnan ; et al.	2008-06-19

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