Goida; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goida; Thomas.The latest application filed is for "pre-molded mems device package with conductive shell".

Company Profile

0.11.9

Goida; Thomas - Windham NH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pre-molded MEMS device package with conductive shell Grant 9,260,293 - Goida February 16, 2	2016-02-16
Reduced footprint microphone system with spacer member having through-hole Grant 9,215,519 - Goida December 15, 2	2015-12-15
Packages and methods for packaging Grant 9,142,470 - Yang , et al. September 22, 2	2015-09-22
Pre-Molded MEMS Device Package with Conductive Shell App 20150102436 - Goida; Thomas	2015-04-16
Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die Grant 8,946,879 - Goida February 3, 2	2015-02-03
Packages And Methods For Packaging App 20140332947 - Yang; Jicheng ; et al.	2014-11-13
Packages and methods for packaging using a lid having multiple conductive layers Grant 8,723,308 - Yang , et al. May 13, 2	2014-05-13
Packages And Methods For 3d Integration App 20140027867 - Goida; Thomas	2014-01-30
Packages and methods for packaging MEMS microphone devices Grant 8,447,057 - Goida , et al. May 21, 2	2013-05-21
Packages And Methods For Packaging Mems Microphone Devices App 20120237073 - Goida; Thomas ; et al.	2012-09-20
Packages And Methods For Packaging App 20120126347 - Yang; Jicheng ; et al.	2012-05-24
Reduced Footprint Microphone System with Spacer Member Having Through-Hole App 20120027234 - Goida; Thomas	2012-02-02
Stress free package and laminate-based isolator package Grant 7,871,865 - Sengupta , et al. January 18, 2	2011-01-18
Die Coat Perimeter To Enhance Semiconductor Reliability App 20080197514 - Goida; Thomas	2008-08-21
Stress Free Package And Laminate-based Isolator Package App 20080176362 - Sengupta; Dipak ; et al.	2008-07-24

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