Goh; Mow Huat
Patent Applications and Registrations
Patent applications and USPTO patent grants for Goh; Mow Huat.The latest application filed is for "method for measuring the heights of wire interconnections".
- Goh; Mow Huat - Singapore SG
- Goh; Mow Huat - Johor MY
| Patent | Date |
|---|---|
| Formation of bonding wire vertical interconnects Grant 11,145,620 - Goh , et al. October 12, 2 | 2021-10-12 |
| Method For Measuring The Heights Of Wire Interconnections App 20200348243 - SONG; Keng Yew ; et al. | 2020-11-05 |
| Formation Of Bonding Wire Vertical Interconnects App 20200286855 - GOH; Mow Huat ; et al. | 2020-09-10 |
| Wire bonding method for forming low-loop profiles Grant 7,780,064 - Wong , et al. August 24, 2 | 2010-08-24 |
| Wire Bonding Method For Forming Low-loop Profiles App 20070284416 - WONG; Yam Mo ; et al. | 2007-12-13 |
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