Goh; Kok Siang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Goh; Kok Siang.The latest application filed is for "thin plastic leadless package with exposed metal die paddle".
- Goh; Kok Siang - Perak MY
- Goh, Kok Siang - Ipoh MY
| Patent | Date |
|---|---|
| Thin plastic leadless package with exposed metal die paddle Grant 9,691,688 - Yee , et al. June 27, 2 | 2017-06-27 |
| Thin Plastic Leadless Package With Exposed Metal Die Paddle App 20160049357 - Yee; Mow Lum ; et al. | 2016-02-18 |
| Thin plastic leadless package with exposed metal die paddle Grant 9,190,385 - Yee , et al. November 17, 2 | 2015-11-17 |
| Multiple row exposed leads for MLP high density packages Grant 7,846,774 - Yee , et al. December 7, 2 | 2010-12-07 |
| Thin Plastic Leadless Package with Exposed Metal Die Paddle App 20090026594 - Yee; Mow Lum ; et al. | 2009-01-29 |
| Method of making the mould for encapsulating a leadframe package Grant 7,351,611 - Yee , et al. April 1, 2 | 2008-04-01 |
| Multiple Row Exposed Leads For Mlp High Density Packages App 20070281392 - Yee; Mow Lum ; et al. | 2007-12-06 |
| Mould for encapsulating a leadframe package and method of making the same App 20050186711 - Yee, Richard Mow Lum ; et al. | 2005-08-25 |
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