Goh; Kok Chai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Goh; Kok Chai.The latest application filed is for "electronic device with multi-layer contact and system".
- Goh; Kok Chai - Melaka MY
- Goh; Kok Chai - Regensburg DE
| Patent | Date |
|---|---|
| Electronic Device with Multi-Layer Contact and System App 20200075530 - Heinrich; Alexander ; et al. | 2020-03-05 |
| Method for producing electronic device with multi-layer contact Grant 10,475,761 - Heinrich , et al. Nov | 2019-11-12 |
| Method for Producing Electronic Device With Multi-Layer Contact App 20190006311 - Heinrich; Alexander ; et al. | 2019-01-03 |
| Electronic Device with Multi-Layer Contact App 20170025375 - Heinrich; Alexander ; et al. | 2017-01-26 |
| Electronic device with multi-layer contact Grant 9,490,193 - Heinrich , et al. November 8, 2 | 2016-11-08 |
| Bump package and methods of formation thereof Grant 9,373,609 - Ong , et al. June 21, 2 | 2016-06-21 |
| Semiconductor package with multi-level die block Grant 9,275,944 - Goh March 1, 2 | 2016-03-01 |
| Molding material and method for packaging semiconductor chips Grant 9,209,152 - Goh , et al. December 8, 2 | 2015-12-08 |
| High power single-die semiconductor package Grant 9,054,063 - Goh , et al. June 9, 2 | 2015-06-09 |
| Semiconductor Package with Multi-Level Die Block App 20150061096 - Goh; Kok Chai | 2015-03-05 |
| Molding Material and Method for Packaging Semiconductor Chips App 20140312497 - Goh; Kok Chai ; et al. | 2014-10-23 |
| High Power Single-Die Semiconductor Package App 20140299981 - Goh; Kok Chai ; et al. | 2014-10-09 |
| Bump Package and Methods of Formation Thereof App 20140110835 - Ong; Meng Tong ; et al. | 2014-04-24 |
| Electronic Device and a Method for Fabricating an Electronic Device App 20130140685 - Heinrich; Alexander ; et al. | 2013-06-06 |
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