Goh; Kim-Yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goh; Kim-Yong.The latest application filed is for "semiconductor packages having an electric device with a recess".

Company Profile

1.34.33

Goh; Kim-Yong - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages having an electric device with a recess Grant 10,658,238 - Goh , et al.	2020-05-19
Semiconductor Packages Having An Electric Device With A Recess App 20180040514 - Goh; Kim-Yong ; et al.	2018-02-08
Semiconductor packages having an electric device with a recess Grant 9,824,924 - Goh , et al. November 21, 2	2017-11-21
Integrated circuit device with shaped leads and method of forming the device Grant 9,679,870 - Ma , et al. June 13, 2	2017-06-13
Electronic device with heat dissipater Grant 9,620,438 - Duca , et al. April 11, 2	2017-04-11
Wafer level chip scale package (WLCSP) having edge protection Grant 9,576,912 - Ma , et al. February 21, 2	2017-02-21
Electronic Device With Dummy Ic Die And Related Methods App 20160293512 - MA; Yiyi ; et al.	2016-10-06
Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming Grant 9,449,912 - Zhang , et al. September 20, 2	2016-09-20
Method Of Making An Electronic Device Including Two-step Encapsulation And Related Devices App 20160190029 - GOH; Kim-Yong ; et al.	2016-06-30
Method of making an electronic device including two-step encapsulation and related devices Grant 9,379,034 - Goh , et al. June 28, 2	2016-06-28
Integrated Circuit Device With Shaped Leads And Method Of Forming The Device App 20160172262 - MA; Yiyi ; et al.	2016-06-16
Surface mount package for a semiconductor integrated device, related assembly and manufacturing process Grant 9,257,372 - Duca , et al. February 9, 2	2016-02-09
Electronic Device Including Components In Component Receiving Cavity And Related Methods App 20150332995 - GOH; Kim-Yong ; et al.	2015-11-19
Electronic Device With Heat Dissipater App 20150235929 - Duca; Roseanne ; et al.	2015-08-20
No-lead Semiconductor Package And Method Of Manufacturing The Same App 20150084171 - Ma; Yiyi ; et al.	2015-03-26
Methods and devices for packaging integrated circuits Grant 8,907,465 - Goh , et al. December 9, 2	2014-12-09
Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture Grant 8,884,422 - Goh , et al. November 11, 2	2014-11-11
Methods And Devices For Packaging Integrated Circuits App 20140291782 - Goh; Kim-Yong ; et al.	2014-10-02
Semiconductor Packages Having An Electric Device With A Recess App 20140291812 - Goh; Kim-Yong ; et al.	2014-10-02
System in package manufacturing method using wafer-to-wafer bonding Grant 8,822,267 - Hwang , et al. September 2, 2	2014-09-02
Window clamp top plate for integrated circuit packaging Grant 8,796,826 - Zhang , et al. August 5, 2	2014-08-05
Offset of contact opening for copper pillars in flip chip packages Grant 8,772,943 - Zhang , et al. July 8, 2	2014-07-08
System In Package Manufacturing Method Using Wafer-to-wafer Bonding App 20140113410 - Hwang; How Yuan ; et al.	2014-04-24
Surface Mount Package For A Semiconductor Integrated Device, Related Assembly And Manufacturing Process App 20140091443 - Duca; Roseanne ; et al.	2014-04-03
Ultra-thin quad flat no-lead (QFN) package Grant 8,642,396 - Goh , et al. February 4, 2	2014-02-04
Ball grid array to pin grid array conversion Grant 8,637,352 - Goh January 28, 2	2014-01-28
Multi-stacked semiconductor dice scale package structure and method of manufacturing same Grant 8,502,394 - Goh August 6, 2	2013-08-06
Window Clamp Top Plate For Integrated Circuit Packaging App 20130161806 - ZHANG; Xueren ; et al.	2013-06-27
Fan-out wafer level package for an optical sensor and method of manufacture thereof Grant 8,466,997 - Goh , et al. June 18, 2	2013-06-18
Balanced Leadframe Package Structure And Method Of Manufacturing The Same App 20130147024 - GOH; Kim-Yong ; et al.	2013-06-13
Offset Of Contact Opening For Copper Pillars In Flip Chip Packages App 20130147052 - Zhang; Xueren ; et al.	2013-06-13
Ball Grid Array To Pin Grid Array Conversion App 20130127041 - Goh; Kim-Yong	2013-05-23
Fan-out wafer level package with polymeric layer for high reliability Grant 8,436,255 - Goh May 7, 2	2013-05-07
Leadframe Pad Design With Enhanced Robustness To Die Crack Failure App 20130093072 - Zhang; Xueren ; et al.	2013-04-18
Semiconductor package and method of manufacturing the same Grant 8,410,598 - Goh April 2, 2	2013-04-02
Chip Scale Package structure with can attachment Grant 8,389,335 - Goh , et al. March 5, 2	2013-03-05
Chip Scale Package Structure With Can Attachment App 20120178213 - Goh; Kim-Yong ; et al.	2012-07-12
Low Cost Thermally Enhanced Hybrid Bga And Method Of Manufacturing The Same App 20120168929 - Goh; Kim-Yong	2012-07-05
Chip scale package structure with can attachment Grant 8,164,179 - Goh , et al. April 24, 2	2012-04-24
Ultra-thin Quad Flat No-lead (qfn) Package App 20120028397 - Goh; Kim-yong ; et al.	2012-02-02
Ultra-thin quad flat no-lead (QFN) package Grant 8,018,036 - Goh , et al. September 13, 2	2011-09-13
Flip-chip Fan-out Wafer Level Package For Package-on-package Applications, And Method Of Manufacture App 20110156250 - Goh; Kim-Yong ; et al.	2011-06-30
Reliable Large Die Fan-out Wafer Level Package And Method Of Manufacture App 20110156240 - Luan; Jing-En ; et al.	2011-06-30
Fan-out Wafer Level Package With Polymeric Layer For High Reliability App 20110157853 - Goh; Kim-Yong	2011-06-30
Multi-stacked Semiconductor Dice Scale Package Structure And Method Of Manufacturing Same App 20110156230 - Goh; Kim-Yong	2011-06-30
Fan-out Wafer Level Package For An Optical Sensor And Method Of Manufacture Thereof App 20110157452 - Goh; Kim-Yong ; et al.	2011-06-30
Step cavity for enhanced drop test performance in ball grid array package Grant 7,956,475 - Goh , et al. June 7, 2	2011-06-07
Step Cavity For Enhanced Drop Test Performance In Ball Grid Array Package App 20100148363 - Goh; Kim-Yong ; et al.	2010-06-17
Chip Scale Package Structure With Can Attachment App 20100148347 - Goh; Kim-Yong ; et al.	2010-06-17
Molded high density electronic packaging structure for high performance applications Grant 7,361,995 - Goh , et al. April 22, 2	2008-04-22
Ultra-thin quad flat no-lead (QFN) package App 20070114641 - Goh; Kim-yong ; et al.	2007-05-24
Molded high density electronic packaging structure for high performance applications App 20060087033 - Goh; Kim Yong ; et al.	2006-04-27

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