Goh; Hin Hwa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goh; Hin Hwa.The latest application filed is for "semiconductor device and method of balancing surfaces of an embedded pcb unit with a dummy copper pattern".

Company Profile

4.38.33

Goh; Hin Hwa - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 10,790,158 - Lin , et al. September 29, 2	2020-09-29
Semiconductor device and method of controlling warpage in reconstituted wafer Grant 10,297,556 - Heng , et al.	2019-05-21
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern App 20190109015 - Lin; Yaojian ; et al.	2019-04-11
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 10,177,010 - Lin , et al. J	2019-01-08
Semiconductor device and method of controlling warpage in reconstituted wafer Grant 10,163,747 - Heng , et al. Dec	2018-12-25
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer App 20170194228 - Heng; Kian Meng ; et al.	2017-07-06
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 9,666,500 - Lin , et al. May 30, 2	2017-05-30
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer App 20170133330 - Heng; Kian Meng ; et al.	2017-05-11
Semiconductor device and method of controlling warpage in reconstituted wafer Grant 9,607,965 - Heng , et al. March 28, 2	2017-03-28
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern App 20160351419 - Lin; Yaojian ; et al.	2016-12-01
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 9,449,943 - Lin , et al. September 20, 2	2016-09-20
Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof Grant 9,236,278 - Huang , et al. January 12, 2	2016-01-12
Semiconductor device and method of forming FO-WLCSP with multiple encapsulants Grant 9,142,428 - Lin , et al. September 22, 2	2015-09-22
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief App 20150228552 - Lin; Yaojian ; et al.	2015-08-13
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 9,087,930 - Lin , et al. July 21, 2	2015-07-21
Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support Grant 9,054,083 - Suthiwongsunthorn , et al. June 9, 2	2015-06-09
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern App 20150115465 - Lin; Yaojian ; et al.	2015-04-30
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer App 20150084213 - Heng; Kian Meng ; et al.	2015-03-26
Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface Grant 8,916,416 - Omandam , et al. December 23, 2	2014-12-23
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief App 20140246779 - Lin; Yaojian ; et al.	2014-09-04
Integrated circuit packaging system with warpage control and method of manufacture thereof Grant 8,766,426 - Goh , et al. July 1, 2	2014-07-01
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 8,759,155 - Lin , et al. June 24, 2	2014-06-24
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20140110861 - Suthiwongsunthorn; Nathapong ; et al.	2014-04-24
Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants App 20140077381 - Lin; Yaojian ; et al.	2014-03-20
Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Grant 8,659,162 - Suthiwongsunthorn , et al. February 25, 2	2014-02-25
Semiconductor device and method of forming FO-WLCSP with multiple encapsulants Grant 8,648,470 - Lin , et al. February 11, 2	2014-02-11
Integrated circuit packaging system with encapsulation connector and method of manufacture thereof Grant 8,624,364 - Chow , et al. January 7, 2	2014-01-07
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20130175696 - Lin; Yaojian ; et al.	2013-07-11
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 8,456,002 - Lin , et al. June 4, 2	2013-06-04
Integrated circuit packaging system with warpage control and method of manufacture thereof Grant 8,455,991 - Hsiao , et al. June 4, 2	2013-06-04
Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface App 20130127039 - Omandam; Glenn ; et al.	2013-05-23
Semiconductor Device And Method Of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20130113092 - Lin; Yaojian ; et al.	2013-05-09
Integrated circuit packaging system with active surface heat removal and method of manufacture thereof Grant 8,421,212 - Chen , et al. April 16, 2	2013-04-16
Integrated Circuit Packaging System With A Substrate Embedded Dummy-die Paddle And Method Of Manufacture Thereof App 20130075922 - Huang; Rui ; et al.	2013-03-28
Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Grant 8,405,230 - Lee , et al. March 26, 2	2013-03-26
Semiconductor device and method of providing common voltage bus and wire bondable redistribution Grant 8,309,451 - Do , et al. November 13, 2	2012-11-13
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,304,880 - Chow , et al. November 6, 2	2012-11-06
Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution App 20120261817 - Do; Byung Tai ; et al.	2012-10-18
Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants App 20120187568 - Lin; Yaojian ; et al.	2012-07-26
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20120112340 - Lin; Yaojian ; et al.	2012-05-10
Integrated Circuit Packaging System With Warpage Control And Method Of Manufacture Thereof App 20120074560 - Goh; Hin Hwa ; et al.	2012-03-29
Integrated Circuit Packaging System With Warpage Control And Method Of Manufacture Thereof App 20120074588 - Hsiao; Yung Kuan ; et al.	2012-03-29
Integrated Circuit Packaging System With Active Surface Heat Removal And Method Of Manufacture Thereof App 20120068328 - Chen; Kang ; et al.	2012-03-22
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20120061854 - Chow; Seng Guan ; et al.	2012-03-15
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20120013004 - Suthiwongsunthorn; Nathapong ; et al.	2012-01-19
Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support Grant 8,067,308 - Suthiwongsunthorn , et al. November 29, 2	2011-11-29
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20110210436 - Chow; Seng Guan ; et al.	2011-09-01
Semiconductor Flip Chip Package Having Substantially Non-collapsible Spacer And Method Of Manufacture Thereof App 20110108970 - Lee; Jae Soo ; et al.	2011-05-12
Semiconductor flip chip package having substantially non-collapsible spacer Grant 7,880,313 - Lee , et al. February 1, 2	2011-02-01
Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface App 20110012258 - Omandam; Glenn ; et al.	2011-01-20
Semiconductor Device and Method of Forming an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20100308443 - Suthiwongsunthorn; Nathapong ; et al.	2010-12-09
Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patterns Grant 7,666,709 - Lin , et al. February 23, 2	2010-02-23
Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution App 20090032975 - Do; Byung Tai ; et al.	2009-02-05
Etched leadframe flipchip package system Grant 7,414,318 - Shim , et al. August 19, 2	2008-08-19
Etched Leadframe Flipchip Package System App 20070241432 - Shim; Il Kwon ; et al.	2007-10-18
Etched leadframe flipchip package system Grant 7,250,685 - Shim , et al. July 31, 2	2007-07-31
Etched Leadframe Flipchip Package System App 20070108565 - Shim; Il Kwon ; et al.	2007-05-17
Semiconductor package flip chip interconnect having spacer App 20060192295 - Lee; Jae Soo ; et al.	2006-08-31

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