| Patent | Date |
|---|
Chassis interconnect for an electronic device
Grant 11,445,608 - Lim , et al. September 13, 2 | 2022-09-13 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20220230958 - SIR; Jiun Hann ; et al. | 2022-07-21 |
Floating-bridge interconnects and methods of assembling same
Grant 11,393,760 - Koh , et al. July 19, 2 | 2022-07-19 |
Through-substrate Underfill Formation For An Integrated Circuit Assembly
App 20220181289 - Goh; Eng Huat ; et al. | 2022-06-09 |
Multi-use Package Architecture
App 20220181227 - Goh; Eng Huat ; et al. | 2022-06-09 |
Co-planar Interconnection Mechanisms For Circuit Boards
App 20220174820 - Chang; Mooi Ling ; et al. | 2022-06-02 |
Systems, Methods, And Apparatuses For Implementing A Pad On Solder Mask (posm) Semiconductor Substrate Package
App 20220173027 - GOH; Eng Huat ; et al. | 2022-06-02 |
Electronic Package With Passive Component Between Substrates
App 20220139814 - Goh; Eng Huat ; et al. | 2022-05-05 |
Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages
Grant 11,322,434 - Sir , et al. May 3, 2 | 2022-05-03 |
Board to board interconnect
Grant 11,304,299 - Wong , et al. April 12, 2 | 2022-04-12 |
Stepped Package And Recessed Circuit Board
App 20220110214 - Chang; Martin M. ; et al. | 2022-04-07 |
Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package
Grant 11,289,414 - Goh , et al. March 29, 2 | 2022-03-29 |
System In Package Dual Connector
App 20220078911 - CHUAH; Tin Poay ; et al. | 2022-03-10 |
Organic Mold Interconnects In Shielded Interconnects Frames For Integrated-circuit Packages
App 20220077047 - Sir; Jiun Hann ; et al. | 2022-03-10 |
Wrappable Emi Shields
App 20220068834 - GOH; Eng Huat ; et al. | 2022-03-03 |
Extended package air core inductor
Grant 11,264,160 - Goh , et al. March 1, 2 | 2022-03-01 |
Electronic package with passive component between substrates
Grant 11,264,315 - Goh , et al. March 1, 2 | 2022-03-01 |
Slot Antenna On A Printed Circuit Board (pcb)
App 20220052458 - GOH; Eng Huat ; et al. | 2022-02-17 |
Slot antenna on a printed circuit board (PCB)
Grant 11,211,714 - Goh , et al. December 28, 2 | 2021-12-28 |
Organic mold interconnects in shielded interconnects frames for integrated-circuit packages
Grant 11,205,613 - Sir , et al. December 21, 2 | 2021-12-21 |
Integrating System In Package (sip) With Input/output (io) Board For Platform Miniaturization
App 20210366883 - Goh; Eng Huat ; et al. | 2021-11-25 |
Flexible shield for semiconductor devices
Grant 11,177,226 - Cheah , et al. November 16, 2 | 2021-11-16 |
Flexible printed circuit EMI enclosure
Grant 11,178,768 - Yong , et al. November 16, 2 | 2021-11-16 |
Multi-planar circuit board having reduced z-height
Grant 11,172,581 - Goh , et al. November 9, 2 | 2021-11-09 |
Electronic device packaging
Grant 11,133,261 - Goh , et al. September 28, 2 | 2021-09-28 |
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
Grant 11,114,421 - Goh , et al. September 7, 2 | 2021-09-07 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20210202380 - SIR; Jiun Hann ; et al. | 2021-07-01 |
System And Method For Stacking Wire-bond Converted Flip-chip Die
App 20210202441 - GOH; ENG HUAT ; et al. | 2021-07-01 |
Reverse-bridge Multi-die Interconnect For Integrated-circuit Packages
App 20210183775 - Lim; Min Suet ; et al. | 2021-06-17 |
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
Grant 10,998,262 - Sir , et al. May 4, 2 | 2021-05-04 |
Organic Mold Interconnects In Shielded Interconnects Frames For Integrated-circuit Packages
App 20210098352 - Sir; Jiun Hann ; et al. | 2021-04-01 |
Chassis Interconnect For An Electronic Device
App 20210100101 - Lim; Chee How ; et al. | 2021-04-01 |
Programmable redistribution die
Grant 10,943,864 - Goh , et al. March 9, 2 | 2021-03-09 |
Top-to-bottom Interconnects With Molded Lead-frame Module For Integrated-circuit Packages
App 20210057318 - Sir; Jiun Hann ; et al. | 2021-02-25 |
Semiconductor package having integrated stiffener region
Grant 10,923,415 - Goh , et al. February 16, 2 | 2021-02-16 |
Combination Stiffener And Capacitor
App 20210035738 - Goh; Eng Huat ; et al. | 2021-02-04 |
Electronic Device Package On Package (pop)
App 20210035880 - Goh; Eng Huat ; et al. | 2021-02-04 |
Rfi Free Picture Frame Metal Stiffener
App 20200411448 - GOH; Eng Huat ; et al. | 2020-12-31 |
Floating-bridge Interconnects And Methods Of Assembling Same
App 20200411438 - Koh; Boon Ping ; et al. | 2020-12-31 |
Board To Board Interconnect
App 20200404787 - Wong; Chee Ling ; et al. | 2020-12-24 |
Dynamic random access memory (DRAM) mounts
Grant 10,861,839 - Goh , et al. December 8, 2 | 2020-12-08 |
Electromagnetic interference (EMI) shield for circuit card assembly (CCA)
Grant 10,856,454 - Lim , et al. December 1, 2 | 2020-12-01 |
Disaggregated Die Interconnection With On-silicon Cavity Bridge
App 20200357744 - YONG; Khang Choong ; et al. | 2020-11-12 |
Stripped Redistrubution-layer Fabrication For Package-top Embedded Multi-die Interconnect Bridge
App 20200328151 - Sir; Jiun Hann ; et al. | 2020-10-15 |
Floating-bridge interconnects and methods of assembling same
Grant 10,796,999 - Koh , et al. October 6, 2 | 2020-10-06 |
Package jumper interconnect
Grant 10,785,872 - Goh , et al. Sept | 2020-09-22 |
Board to board interconnect
Grant 10,772,206 - Wong , et al. Sep | 2020-09-08 |
Fiber weave-sandwiched differential pair routing technique
Grant 10,716,209 - Cheah , et al. | 2020-07-14 |
Extended stiffener for platform miniaturization
Grant 10,643,983 - Goh , et al. | 2020-05-05 |
Fiber Weave-sandwiched Differential Pair Routing Technique
App 20200137886 - Cheah; Bok Eng ; et al. | 2020-04-30 |
Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same
Grant 10,636,749 - Leong , et al. | 2020-04-28 |
Capacitive interconnect in a semiconductor package
Grant 10,609,813 - Goh , et al. | 2020-03-31 |
Flexible computing device that includes a plurality of displays
Grant 10,606,316 - Kong , et al. | 2020-03-31 |
Flexible Shield For Semiconductor Devices And Methods
App 20200091093 - Cheah; Bok Eng ; et al. | 2020-03-19 |
Programmable Redistribution Die
App 20200083157 - Goh; Eng Huat ; et al. | 2020-03-12 |
Extended Package Air Core Inductor
App 20200027639 - Goh; Eng Huat ; et al. | 2020-01-23 |
Dynamic Random Access Memory (dram) Mounts
App 20200027867 - Goh; Eng Huat ; et al. | 2020-01-23 |
Integrating System In Package (sip) With Input/output (io) Board For Platform Miniaturization
App 20190378828 - Goh; Eng Huat ; et al. | 2019-12-12 |
Electromagnetic Interference (emi) Shield For Circuit Card Assembly (cca)
App 20190364702 - Lim; Min Suet ; et al. | 2019-11-28 |
Electronic assembly that includes a substrate bridge
Grant 10,492,299 - Goh , et al. Nov | 2019-11-26 |
Slot Antenna On A Printed Circuit Board (pcb)
App 20190348766 - GOH; Eng Huat ; et al. | 2019-11-14 |
Board To Board Interconnect
App 20190342996 - Wong; Chee Ling ; et al. | 2019-11-07 |
Integrated circuit package with microstrip routing and an external ground plane
Grant 10,438,882 - Goh O | 2019-10-08 |
Floating-bridge Interconnects And Methods Of Assembling Same
App 20190304914 - Koh; Boon Ping ; et al. | 2019-10-03 |
Package Jumper Interconnect
App 20190306978 - Goh; Eng Huat ; et al. | 2019-10-03 |
Multi-use Package Architecture
App 20190287872 - Goh; Eng Huat ; et al. | 2019-09-19 |
Dynamic random access memory (DRAM) mounts
Grant 10,411,001 - Goh , et al. Sept | 2019-09-10 |
Integrating system in package (SIP) with input/output (IO) board for platform miniaturization
Grant 10,388,636 - Goh , et al. A | 2019-08-20 |
On-package Integrated Stiffener Antenna
App 20190221529 - Yong; Khang Choong ; et al. | 2019-07-18 |
Board to board interconnect
Grant 10,356,902 - Wong , et al. July 16, 2 | 2019-07-16 |
Semiconductor Package Having Integrated Stiffener Region
App 20190214338 - GOH; Eng Huat ; et al. | 2019-07-11 |
Apparatus utilizing computer on package construction
Grant 10,317,938 - Goh , et al. | 2019-06-11 |
Multiple-component substrate for a microelectronic device
Grant 10,297,541 - Lim , et al. | 2019-05-21 |
Semiconductor Package Substrate Support Structures For Ball-grid Array Cavities, And Methods Of Assembling Same
App 20190148310 - Leong; Kean Huat ; et al. | 2019-05-16 |
Systems, Methods, And Apparatuses For Implementing A Pad On Solder Mask (posm) Semiconductor Substrate Package
App 20190122974 - GOH; Eng Huat ; et al. | 2019-04-25 |
Reduced-height electronic memory system and method
Grant 10,256,213 - Goh , et al. | 2019-04-09 |
Stranded transmission line and uses thereof
Grant 10,256,519 - Song , et al. | 2019-04-09 |
Electronic Package With Passive Component Between Substrates
App 20190103346 - Goh; Eng Huat ; et al. | 2019-04-04 |
Electronic Device Packaging
App 20190103358 - Goh; Eng Huat ; et al. | 2019-04-04 |
Methods Of Forming Package On Package Assemblies With Reduced Z Height And Structures Formed Thereby
App 20190103357 - Lim; Min Suet ; et al. | 2019-04-04 |
Wirebond Interconnect Structures For Stacked Die Packages
App 20190035761 - Goh; Eng Huat ; et al. | 2019-01-31 |
Extended Stiffener For Platform Miniaturization
App 20190013303 - GOH; Eng Huat ; et al. | 2019-01-10 |
Multi-planar Circuit Board Having Reduced Z-height
App 20190008052 - Goh; Eng Huat ; et al. | 2019-01-03 |
Interconnects for semiconductor packages
Grant 10,163,777 - Lim , et al. Dec | 2018-12-25 |
Dynamic Random Access Memory (dram) Mounts
App 20180366457 - Goh; Eng Huat ; et al. | 2018-12-20 |
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus
Grant 10,153,253 - Loo , et al. Dec | 2018-12-11 |
Flexible Computing Device That Includes A Plurality Of Displays
App 20180348823 - KONG; Jackson Chung Peng ; et al. | 2018-12-06 |
Integrating System In Package (sip) With Input/output (io) Board For Platform Miniaturization
App 20180331081 - Goh; Eng Huat ; et al. | 2018-11-15 |
Interconnects For Semiconductor Packages
App 20180286804 - LIM; SEOK LING ; et al. | 2018-10-04 |
Integrated Circuit Package With Microstrip Routing And An External Ground Plane
App 20180286797 - Goh; Eng Huat | 2018-10-04 |
Inductor interconnect
Grant 10,083,922 - Lim , et al. September 25, 2 | 2018-09-25 |
Stranded Transmission Line And Uses Thereof
App 20180192509 - Song; Wil Choon ; et al. | 2018-07-05 |
Foldable fabric-based packaging solution
Grant 10,014,710 - Cheah , et al. July 3, 2 | 2018-07-03 |
Package-bottom Interposers For Land-side Configured Devices For System-in-package Apparatus
App 20180175002 - Loo; Howe Yin ; et al. | 2018-06-21 |
Inductor Interconnect
App 20180145042 - Lim; Min Suet ; et al. | 2018-05-24 |
Multiple-component Substrate For A Microelectronic Device
App 20180145016 - Lim; Min Suet ; et al. | 2018-05-24 |
Package-bottom Through-mold Via Interposers For Land-side Configured Devices For System-in-package Apparatus
App 20180145051 - Loo; Howe Yin ; et al. | 2018-05-24 |
Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer
Grant 9,972,589 - Goh , et al. May 15, 2 | 2018-05-15 |
Three capacitor stack and associated methods
Grant 9,960,224 - Goh , et al. May 1, 2 | 2018-05-01 |
Three Capacitor Stack And Associated Methods
App 20180097056 - Goh; Eng Huat ; et al. | 2018-04-05 |
FPC connector for better signal integrity and design compaction
Grant 9,907,170 - Goh , et al. February 27, 2 | 2018-02-27 |
Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices
Grant 9,893,444 - Kong , et al. February 13, 2 | 2018-02-13 |
Capacitive Interconnect In A Semiconductor Package
App 20170359893 - Goh; Eng Huat ; et al. | 2017-12-14 |
Microelectronic device package electromagnetic shield
Grant 9,836,095 - Lim , et al. December 5, 2 | 2017-12-05 |
Flexible Printed Circuit Emi Enclosure
App 20170290154 - Yong; Khang Choong ; et al. | 2017-10-05 |
Board to board interconnect
App 20170188461 - Wong; Chee Ling ; et al. | 2017-06-29 |
Fpc Connector For Better Signal Integrity And Design Compaction
App 20170181281 - GOH; Eng Huat ; et al. | 2017-06-22 |
Foldable Fabric-based Packaging Solution
App 20170170676 - CHEAH; Bok Eng ; et al. | 2017-06-15 |
Reduced-height Memory System And Method
App 20170170147 - Goh; Eng Huat ; et al. | 2017-06-15 |
Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias
Grant 9,613,920 - Goh , et al. April 4, 2 | 2017-04-04 |
Universal Scalable System: On-the-fly System Performance Conversion Via Pc-on-a-card And Usb For Smart Devices And Iot Enabling
App 20170091131 - YONG; KHANG CHOONG ; et al. | 2017-03-30 |
Board-edge Interconnection Module With Integrated Capacitive Coupling For Enabling Ultra-mobile Computing Devices
App 20170093064 - KONG; JACKSON CHUNG PENG ; et al. | 2017-03-30 |
Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enabling
Grant 9,606,949 - Yong , et al. March 28, 2 | 2017-03-28 |
Substrate Including Structures To Couple A Capacitor To A Packaged Device And Method Of Making Same
App 20170086298 - Chuah; Tin Poay ; et al. | 2017-03-23 |
Apparatus Utilizing Computer On Package Construction
App 20160216731 - Goh; Eng Huat ; et al. | 2016-07-28 |
Microelectronic Package Utilizing Multiple Bumpless Build-up Structures And Through-silicon Vias
App 20160118354 - Goh; Eng Huat ; et al. | 2016-04-28 |
Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias
Grant 9,257,368 - Goh , et al. February 9, 2 | 2016-02-09 |
Microelectric Package Utilizing Multiple Bumpless Build-up Structures And Through-silicon Vias
App 20140021635 - Goh; Eng Huat ; et al. | 2014-01-23 |
Multi-stacked Bbul Package
App 20130313727 - Goh; Eng Huat ; et al. | 2013-11-28 |
Interconnects with interlocks
Grant 7,795,736 - Sir , et al. September 14, 2 | 2010-09-14 |
Method and apparatus for reducing electrical interconnection fatigue
Grant 7,642,660 - Tay , et al. January 5, 2 | 2010-01-05 |
Interconnects with interlocks
App 20070164438 - Sir; Jiun Hann ; et al. | 2007-07-19 |
Interconnects with interlocks
Grant 7,217,651 - Sir , et al. May 15, 2 | 2007-05-15 |
Method And Apparatus For Reducing Electrical Interconnection Fatigue
App 20070102817 - Tay; Cheng Siew ; et al. | 2007-05-10 |
Method and apparatus for reducing electrical interconnection fatigue
Grant 7,173,342 - Tay , et al. February 6, 2 | 2007-02-06 |
Interconnects with interlocks
App 20060022341 - Sir; Jiun Hann ; et al. | 2006-02-02 |
Method and apparatus for reducing electrical interconnection fatigue
App 20040113285 - Tay, Cheng Siew ; et al. | 2004-06-17 |
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