Goh; Clinton
Patent Applications and Registrations
Patent applications and USPTO patent grants for Goh; Clinton.The latest application filed is for "methods and apparatus for cleaving of semiconductor substrates".
- Goh; Clinton - Singapore SG
| Patent | Date |
|---|---|
| Methods and apparatus for high voltage electrostatic chuck protection Grant 11,289,357 - Wada , et al. March 29, 2 | 2022-03-29 |
| Methods and Apparatus for Cleaving of Semiconductor Substrates App 20210233802 - DENG; Felix ; et al. | 2021-07-29 |
| Methods And Apparatus For Cleaving Of Semiconductor Substrates App 20210217656 - DENG; Felix ; et al. | 2021-07-15 |
| Methods and apparatus for cleaving of semiconductor substrates Grant 10,991,617 - Deng , et al. April 27, 2 | 2021-04-27 |
| Methods And Apparatus For Microwave Processing Of Polymer Materials App 20210001520 - KOH; Tuck Foong ; et al. | 2021-01-07 |
| Methods And Apparatus For High Voltage Electrostatic Chuck Protection App 20200411353 - WADA; YUICHI ; et al. | 2020-12-31 |
| Methods And Apparatus For Cleaving Of Semiconductor Substrates App 20190355616 - DENG; FELIX ; et al. | 2019-11-21 |
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