Goetze; Christian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Goetze; Christian.The latest application filed is for "chip module with robust in-package interconnects".

Company Profile

3.4.6

Goetze; Christian - Rostock DE
Goetze; Christian - Dresden DE
Goetze; Christian - Berlin DE
Goetze; Christian - Wohlenschwil CH
Goetze; Christian - Herrenberg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Correcting segmented surfaces to align with a rendering of volumetric data Grant 11,423,612 - Loeffler , et al. August 23, 2	2022-08-23
Chip Module With Robust In-package Interconnects App 20220238448 - Halim; Saquib B. ; et al.	2022-07-28
Correcting Segmented Surfaces To Align With A Rendering Of Volumetric Data App 20200273244 - Loeffler; Falko ; et al.	2020-08-27
Wafer Level Packaging With Integrated Antenna Structures App 20200075513 - Wieland; Marcel ; et al.	2020-03-05
Wafer level packaging with integrated antenna structures Grant 10,580,745 - Wieland , et al.	2020-03-03
Induction hob and flexible support for an induction hob Grant 10,271,386 - Goetze , et al.	2019-04-23
Method for producing an opening in a fiber composite component Grant 9,884,454 - Woerner , et al. February 6, 2	2018-02-06
Induction Hob And Flexible Support For An Induction Hob App 20160302263 - Goetze; Christian ; et al.	2016-10-13
Method And Mold For Producing An Opening In A Fiber Composite Component App 20150231823 - Woerner; Lukas ; et al.	2015-08-20
Drive circuit for an actuator and method for driving an actuator App 20080165467 - Bierbrauer; Franz A. ; et al.	2008-07-10

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