GOCHNOUR; Derek

Patent Applications and Registrations

Patent applications and USPTO patent grants for GOCHNOUR; Derek.The latest application filed is for "image sensor packages and related methods".

Company Profile

1.30.11

GOCHNOUR; Derek - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Image Sensor Packages And Related Methods App 20200411573 - SKEETE; Oswald L. ; et al.	2020-12-31
Chip scale package and related methods Grant 10,770,492 - Su , et al. Sep	2020-09-08
Chip Scale Package And Related Methods App 20180342549 - SU; Bingzhi ; et al.	2018-11-29
Chip scale package and related methods Grant 10,079,254 - Su , et al. September 18, 2	2018-09-18
Chip Scale Package And Related Methods App 20180019275 - SU; Bingzhi ; et al.	2018-01-18
Chip scale package and related methods Grant 9,754,983 - Su , et al. September 5, 2	2017-09-05
Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20160031707 - Greenwood; Jonathon G. ; et al.	2016-02-04
Microelectronic devices and methods for manufacturing microelectronic devices App 20070045807 - Greenwood; Jonathon G. ; et al.	2007-03-01
Hybrid interconnect and system for testing semiconductor dice Grant 7,049,840 - Hembree , et al. May 23, 2	2006-05-23
Spring element for use in an apparatus for attaching to a semiconductor and a method of making Grant 7,011,532 - Hembree , et al. March 14, 2	2006-03-14
Spring element for use in an apparatus for attaching to a semiconductor and a method of making Grant 6,939,145 - Hembree , et al. September 6, 2	2005-09-06
Spring element for use in an apparatus for attaching to a semiconductor and a method of making App 20050191876 - Hembree, David R. ; et al.	2005-09-01
Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching Grant 6,806,493 - Hembree , et al. October 19, 2	2004-10-19
Clip chip carrier Grant 6,730,999 - Farnworth , et al. May 4, 2	2004-05-04
Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching Grant 6,703,640 - Hembree , et al. March 9, 2	2004-03-09
Method of forming a semiconductor chip carrier Grant 6,656,754 - Farnworth , et al. December 2, 2	2003-12-02
Test carrier with molded interconnect for testing semiconductor components Grant 6,642,730 - Hembree , et al. November 4, 2	2003-11-04
Spring element for use in an apparatus for attaching to a semiconductor and a method of making App 20030192172 - Hembree, David R. ; et al.	2003-10-16
Method of making a spring element for use in an apparatus for attaching to a semiconductor Grant 6,598,290 - Hembree , et al. July 29, 2	2003-07-29
Test carrier with molded interconnect for testing semiconductor components Grant 6,544,461 - Hembree , et al. April 8, 2	2003-04-08
Spring element for use in an apparatus for attaching to a semiconductor and a method for making App 20020117791 - Hembree, David R. ; et al.	2002-08-29
Clip chip carrier App 20020053453 - Farnworth, Warren M. ; et al.	2002-05-09
Clip chip carrier Grant 6,351,034 - Farnworth , et al. February 26, 2	2002-02-26
Test Carrier With Molded Interconnect For Testing Semiconductor Components App 20010043074 - HEMBREE, DAVID R. ; et al.	2001-11-22
Carrier and system for testing bumped semiconductor components Grant 6,313,651 - Hembree , et al. November 6, 2	2001-11-06
System for testing semiconductor components having flexible interconnect Grant 6,300,782 - Hembree , et al. October 9, 2	2001-10-09
Flexible semiconductor interconnect fabricated by backslide thinning Grant 6,263,566 - Hembree , et al. July 24, 2	2001-07-24
Semiconductor package with wire bond protective member Grant 6,255,840 - Hembree , et al. July 3, 2	2001-07-03
Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps Grant 6,232,243 - Farnworth , et al. May 15, 2	2001-05-15
Test carrier with variable force applying mechanism for testing semiconductor components App 20010000295 - Farnworth, Warren M. ; et al.	2001-04-19
Method for testing semiconductor components Grant 6,208,157 - Akram , et al. March 27, 2	2001-03-27
System for testing semiconductor components Grant 6,072,326 - Akram , et al. June 6, 2	2000-06-06
Semiconductor package with pre-fabricated cover Grant 6,057,597 - Farnworth , et al. May 2, 2	2000-05-02
Carrier and system for testing bumped semiconductor components Grant 6,040,702 - Hembree , et al. March 21, 2	2000-03-21
Semiconductor package with wire bond protective member Grant 6,025,728 - Hembree , et al. February 15, 2	2000-02-15
Hybrid interconnect and system for testing semiconductor dice Grant 6,025,731 - Hembree , et al. February 15, 2	2000-02-15
Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps Grant 5,962,921 - Farnworth , et al. October 5, 1	1999-10-05
Method for forming an interconnect for testing unpackaged semiconductor dice Grant 5,915,755 - Gochnour , et al. June 29, 1	1999-06-29
Semiconductor package with pre-fabricated cover and method of fabrication Grant 5,893,726 - Farnworth , et al. April 13, 1	1999-04-13
Method for fabricating microbump interconnect for bare semiconductor dice Grant 5,726,075 - Farnworth , et al. March 10, 1	1998-03-10
Method for forming an interconnect for testing unpackaged semiconductor dice Grant 5,678,301 - Gochnour , et al. October 21, 1	1997-10-21

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