Go; Si Hyeon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Go; Si Hyeon.The latest application filed is for "semiconductor package and a method of manufacturing the same".

Company Profile

2.5.5

Go; Si Hyeon - Cheongju-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and a method of manufacturing the same Grant 11,081,419 - Choi , et al. August 3, 2	2021-08-03
Power semiconductor module and method for manufacturing the same Grant 10,431,530 - Choi , et al. O	2019-10-01
Multi-chip package of power semiconductor Grant 10,347,565 - Go , et al. July 9, 2	2019-07-09
Semiconductor Package And A Method Of Manufacturing The Same App 20190198415 - CHOI; Jae Sik ; et al.	2019-06-27
Semiconductor package and a method of manufacturing the same Grant 10,269,677 - Choi , et al.	2019-04-23
Multi-chip Package Of Power Semiconductor App 20180358285 - GO; Si Hyeon ; et al.	2018-12-13
Semiconductor Package And A Method Of Manufacturing The Same App 20180151465 - CHOI; Jae Sik ; et al.	2018-05-31
Power Semiconductor Module And Method For Manufacturing The Same App 20180102309 - CHOI; Jae Sik ; et al.	2018-04-12
Power semiconductor module and method for manufacturing the same Grant 9,893,000 - Choi , et al. February 13, 2	2018-02-13
Power Semiconductor Module And Method For Manufacturing The Same App 20170287821 - CHOI; Jae Sik ; et al.	2017-10-05

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