GMACH; Wolfgang
Patent Applications and Registrations
Patent applications and USPTO patent grants for GMACH; Wolfgang.The latest application filed is for "method for producing semiconductor wafers by means of a wire saw".
- GMACH; Wolfgang - Emmerting DE
| Patent | Date |
|---|---|
| Method For Producing Semiconductor Wafers By Means Of A Wire Saw App 20220040883 - BEYER; Axel ; et al. | 2022-02-10 |
| Method for slicing wafers from a workpiece Grant 9,073,135 - Huber , et al. July 7, 2 | 2015-07-07 |
| Method for slicing wafers from a workpiece Grant 8,746,227 - Huber , et al. June 10, 2 | 2014-06-10 |
| Method For Slicing Wafers From A Workpiece App 20120240914 - Huber; Anton ; et al. | 2012-09-27 |
| Method For Slicing Wafers From A Workpiece App 20120240915 - Huber; Anton ; et al. | 2012-09-27 |
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