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Patent applications and USPTO patent grants for GLOBALFOUNDIES INC..The latest application filed is for "methods of forming finfet devices in different regions of an integrated circuit product".
Patent | Date |
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Fabrication of localized SOI on localized thick box lateral epitaxial realignment of deposited non-crystalline film on bulk semiconductor substrates for photonics device integration Grant 9,236,287 - Assefa , et al. January 12, 2 | 2016-01-12 |
Methods of forming FinFET devices in different regions of an integrated circuit product Grant 9,184,169 - Kim , et al. November 10, 2 | 2015-11-10 |
Methods Of Forming Finfet Devices In Different Regions Of An Integrated Circuit Product App 20150294976 - Kim; Ryan Ryoung-Han ;   et al. | 2015-10-15 |
Copper interconnects with improved electromigration lifetime Grant 8,723,321 - Woo , et al. May 13, 2 | 2014-05-13 |
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