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name:-0.008450984954834
name:-0.0042769908905029
name:-0.00484299659729
GLOBALFOUDRIES INC. Patent Filings

GLOBALFOUDRIES INC.

Patent Applications and Registrations

Patent applications and USPTO patent grants for GLOBALFOUDRIES INC..The latest application filed is for "probe card continuity testing and cleaning fixture comprising highly purified tungsten".

Company Profile
8.4.8
  • GLOBALFOUDRIES INC. - Grand Cay KY
  • GLOBALFOUDRIES INC. - Grand Cayman KY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Probe Card Continuity Testing And Cleaning Fixture Comprising Highly Purified Tungsten
App 20190242927 - Feroli; Ronald A. ;   et al.
2019-08-08
Methods, Apparatus And System For Stringer Defect Reduction In A Trench Cut Region Of A Finfet Device
App 20190097015 - Zang; Hui ;   et al.
2019-03-28
Methods, Apparatus And System For Forming Sigma Shaped Source/drain Lattice
App 20190081175 - Wu; Xusheng ;   et al.
2019-03-14
Methods, Apparatus, And Manufacturing System For Self-aligned Patterning Of A Vertical Transistor
App 20190051563 - Park; Chanro ;   et al.
2019-02-14
Methods, Apparatus And System For Threshold Voltage Control In Finfet Devices
App 20180358272 - Togo; Mitsuhiro ;   et al.
2018-12-13
Semiconductor Structure With Self-aligned Wells And Multiple Channel Materials
App 20180012805 - Brunco; David P.
2018-01-11
Method And Apparatus For Placing A Gate Contact Inside A Semiconductor Active Region Having High-k Dielectric Gate Caps
App 20180012798 - LABONTE; Andre ;   et al.
2018-01-11
Methods, Apparatus And System For Providing Nmos-only Memory Cells
App 20180012647 - Ramamurthy; Hema ;   et al.
2018-01-11
Wiring structures
Grant 9,780,031 - Chen , et al. October 3, 2
2017-10-03
Managing and sharing storage cache resources in a cluster environment
Grant 9,208,094 - Blinick , et al. December 8, 2
2015-12-08
Reducing wafer bonding misalignment by varying thermal treatment prior to bonding
Grant 9,190,303 - La Tulipe, Jr. , et al. November 17, 2
2015-11-17
Metal-semiconductor intermixed regions
Grant 8,278,200 - Lavoie , et al. October 2, 2
2012-10-02

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