Global Advanced Packaging Technology H.K. Limited
Patent Applications and Registrations
Patent applications and USPTO patent grants for Global Advanced Packaging Technology H.K. Limited.The latest application filed is for "electroplated wire layout for package sawing".
- Global Advanced Packaging Technology H.K. Limited - Kowloon HK
| Patent | Date |
|---|---|
| Electroplated wire layout for package sawing Grant 7,098,524 - Wu , et al. August 29, 2 | 2006-08-29 |
| Packaging stacked chips with finger structure Grant 7,095,091 - Wu , et al. August 22, 2 | 2006-08-22 |
| Multiple stacked-chip packaging structure Grant 7,091,590 - Wu , et al. August 15, 2 | 2006-08-15 |
| Structure of gold fingers Grant 6,937,477 - Wu August 30, 2 | 2005-08-30 |
| Substrate structure capable of reducing package singular stress Grant 6,933,592 - Liao , et al. August 23, 2 | 2005-08-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 