Glenn; Thomas P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Glenn; Thomas P..The latest application filed is for "camera module with window mechanical attachment".

Company Profile

0.118.15

Glenn; Thomas P. - Gilbert AZ
Glenn; Thomas P. - late of Gilbert AZ
Glenn; Thomas P. - Modesto CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package and method of making the same Grant 9,224,676 - Glenn December 29, 2	2015-12-29
Integrated circuit package and method of making the same Grant 8,963,301 - Glenn February 24, 2	2015-02-24
Integrated circuit package and method of making the same Grant 8,853,836 - Glenn October 7, 2	2014-10-07
Integrated circuit package and method of making the same Grant 8,318,287 - Glenn November 27, 2	2012-11-27
Camera module with window mechanical attachment Grant 7,786,429 - Glenn , et al. August 31, 2	2010-08-31
Optical module having cavity substrate Grant 7,609,461 - Webster , et al. October 27, 2	2009-10-27
Integrated circuit package and method of making the same Grant 7,560,804 - Glenn July 14, 2	2009-07-14
Camera module with window mechanical attachment App 20080308717 - Glenn; Thomas P. ; et al.	2008-12-18
Snap lid camera module Grant 7,425,750 - Glenn , et al. September 16, 2	2008-09-16
Method of making an integrated circuit package Grant 7,332,375 - Glenn February 19, 2	2008-02-19
Method of making an integrated circuit package Grant 7,112,474 - Glenn September 26, 2	2006-09-26
Plastic integrated circuit package and method and leadframe for making the package Grant 7,071,541 - Glenn July 4, 2	2006-07-04
Optical module with lens integral holder fabrication method Grant 7,059,040 - Webster , et al. June 13, 2	2006-06-13
Plastic integrated circuit package and method and leadframe for making the package Grant 7,030,474 - Glenn April 18, 2	2006-04-18
Method of making an integrated circuit package Grant 7,005,326 - Glenn February 28, 2	2006-02-28
Snap lid camera module App 20060027740 - Glenn; Thomas P. ; et al.	2006-02-09
Mounting for a package containing a chip Grant 6,967,395 - Glenn , et al. November 22, 2	2005-11-22
Method of making near chip size integrated circuit package Grant 6,962,829 - Glenn , et al. November 8, 2	2005-11-08
Method of fabricating and using an image sensor package Grant 6,946,316 - Glenn , et al. September 20, 2	2005-09-20
Wafer having alignment marks extending from a first to a second surface of the wafer Grant 6,943,429 - Glenn , et al. September 13, 2	2005-09-13
Method of making an integrated circuit package Grant 6,893,900 - Glenn May 17, 2	2005-05-17
Tool and method for forming an integrated optical circuit Grant 6,875,379 - Glenn , et al. April 5, 2	2005-04-05
Back-side wafer singulation method Grant 6,869,861 - Glenn , et al. March 22, 2	2005-03-22
Flip chip on glass sensor package Grant 6,849,916 - Glenn , et al. February 1, 2	2005-02-01
Tool And Method For Forming An Integrated Optical Circuit App 20040245659 - Glenn, Thomas P. ; et al.	2004-12-09
VCSEL package and fabrication method Grant 6,816,523 - Glenn , et al. November 9, 2	2004-11-09
Integrated Circuit Package Including Interconnection Posts For Multiple Electrical Connections App 20040173894 - Glenn, Thomas P. ; et al.	2004-09-09
Thin integrated circuit package having an optically transparent window Grant 6,784,534 - Glenn , et al. August 31, 2	2004-08-31
Mounting for a package containing a chip Grant 6,777,789 - Glenn , et al. August 17, 2	2004-08-17
Optical track drain package Grant 6,765,801 - Glenn , et al. July 20, 2	2004-07-20
Method for forming an image sensor package with vision die in lens housing Grant 6,734,419 - Glenn , et al. May 11, 2	2004-05-11
Pre-drilled image sensor package fabrication method Grant 6,730,536 - Glenn , et al. May 4, 2	2004-05-04
Method of making a semiconductor package having exposed metal strap Grant 6,723,582 - Glenn , et al. April 20, 2	2004-04-20
Method of fabricating and using an image sensor package with reflector Grant 6,717,126 - Glenn , et al. April 6, 2	2004-04-06
Optical module with lens integral holder Grant 6,686,588 - Webster , et al. February 3, 2	2004-02-03
Image sensor package with reflector Grant 6,686,580 - Glenn , et al. February 3, 2	2004-02-03
Method of making an integrated circuit package Grant 6,684,496 - Glenn February 3, 2	2004-02-03
Optical fiber having tapered end and optical connector with reciprocal opening Grant 6,672,773 - Glenn , et al. January 6, 2	2004-01-06
Integrated circuit package mounting Grant 6,670,698 - Glenn , et al. December 30, 2	2003-12-30
Stackable package having clips for fastening package and tool for opening clips Grant 6,667,544 - Glenn December 23, 2	2003-12-23
Structure for backside saw cavity protection Grant 6,661,080 - Glenn , et al. December 9, 2	2003-12-09
Integrated circuit chip package having an internal lead Grant 6,657,298 - Glenn December 2, 2	2003-12-02
Method of making a semiconductor package including stacked semiconductor dies Grant 6,650,019 - Glenn , et al. November 18, 2	2003-11-18
Micromachine stacked wirebonded package fabrication method Grant 6,638,789 - Glenn , et al. October 28, 2	2003-10-28
Chip size image sensor bumped package fabrication method Grant 6,629,633 - Glenn , et al. October 7, 2	2003-10-07
Plastic integrated circuit package and leadframe for making the package Grant 6,630,728 - Glenn October 7, 2	2003-10-07
Thin image sensor package Grant 6,627,864 - Glenn , et al. September 30, 2	2003-09-30
Ceramic semiconductor package and method for fabricating the package Grant 6,627,987 - Glenn , et al. September 30, 2	2003-09-30
Micromirror device package fabrication method Grant 6,624,921 - Glenn , et al. September 23, 2	2003-09-23
Chip size image sensor wirebond package fabrication method Grant 6,620,646 - Glenn , et al. September 16, 2	2003-09-16
Method for fabricating a special-purpose die using a polymerizable tape Grant 6,610,167 - Glenn , et al. August 26, 2	2003-08-26
Method of making an electromagnetic interference shield device Grant 6,601,293 - Glenn August 5, 2	2003-08-05
Integrated circuit package having posts for connection to other packages and substrates Grant 6,586,826 - Glenn , et al. July 1, 2	2003-07-01
Plastic integrated circuit device package having exposed lead surface Grant 6,586,677 - Glenn July 1, 2	2003-07-01
Method of making a semiconductor package having exposed metal strap App 20030113954 - Glenn, Thomas P. ; et al.	2003-06-19
Heat spreader with spring IC package Grant 6,580,167 - Glenn , et al. June 17, 2	2003-06-17
Chip size semiconductor packages with stacked dies Grant 6,577,013 - Glenn , et al. June 10, 2	2003-06-10
Flip chip image sensor package fabrication method Grant 6,571,466 - Glenn , et al. June 3, 2	2003-06-03
Exposed copper strap in a semiconductor package Grant 6,566,164 - Glenn , et al. May 20, 2	2003-05-20
Microcircuit die-sawing protector Grant 6,563,204 - Glenn May 13, 2	2003-05-13
Heat spreader with spring IC package fabrication method Grant 6,562,655 - Glenn , et al. May 13, 2	2003-05-13
Mounting for a package containing a chip Grant 6,545,345 - Glenn , et al. April 8, 2	2003-04-08
Method of fabricating and using an image sensor package App 20030056967 - Glenn, Thomas P. ; et al.	2003-03-27
Micromachine stacked flip chip package fabrication method Grant 6,530,515 - Glenn , et al. March 11, 2	2003-03-11
Angulated semiconductor packages Grant 6,532,157 - Glenn , et al. March 11, 2	2003-03-11
Method of assembling a snap lid image sensor package Grant 6,526,653 - Glenn , et al. March 4, 2	2003-03-04
Semiconductor package with molded substrate and recessed input/output terminals Grant 6,528,869 - Glenn , et al. March 4, 2	2003-03-04
Plastic integrated circuit device package and method for making the package Grant 6,521,987 - Glenn , et al. February 18, 2	2003-02-18
Stackable package having a cavity and a lid for an electronic device Grant 6,518,659 - Glenn February 11, 2	2003-02-11
Chip size image sensor in wirebond package with step-up ring for electrical contact Grant 6,509,560 - Glenn , et al. January 21, 2	2003-01-21
Wafer scale image sensor package fabrication method Grant 6,503,780 - Glenn , et al. January 7, 2	2003-01-07
Method of making a semiconductor package including stacked semiconductor dies App 20020195624 - Glenn, Thomas P. ; et al.	2002-12-26
Image sensor package having sealed cavity over active area Grant 6,492,699 - Glenn , et al. December 10, 2	2002-12-10
Pre-drilled ball grid array package Grant 6,486,545 - Glenn , et al. November 26, 2	2002-11-26
Snap lid image sensor package Grant 6,483,030 - Glenn , et al. November 19, 2	2002-11-19
Method of making near chip size integrated circuit package App 20020168798 - Glenn, Thomas P. ; et al.	2002-11-14
Integrated circuit package including pin and barrel interconnects Grant 6,476,476 - Glenn November 5, 2	2002-11-05
Electromagnetic interference shield device with conductive encapsulant and dam Grant 6,472,598 - Glenn October 29, 2	2002-10-29
Semiconductor package including stacked semiconductor dies and bond wires Grant 6,472,758 - Glenn , et al. October 29, 2	2002-10-29
Plastic integrated circuit package and method and leadframe for making the package App 20020148630 - Glenn, Thomas P.	2002-10-17
Microcircuit die-sawing protector and method Grant 6,465,329 - Glenn October 15, 2	2002-10-15
Method of making an integrated circuit package App 20020144396 - Glenn, Thomas P.	2002-10-10
Micromirror device package Grant 6,455,927 - Glenn , et al. September 24, 2	2002-09-24
Methods for moding a leadframe in plastic integrated circuit devices Grant 6,455,356 - Glenn , et al. September 24, 2	2002-09-24
Semiconductor package and circuit board for making the package Grant 6,448,506 - Glenn , et al. September 10, 2	2002-09-10
Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components Grant 6,444,499 - Swiss , et al. September 3, 2	2002-09-03
Precision aligned and marked structure Grant 6,441,504 - Glenn , et al. August 27, 2	2002-08-27
Plastic integrated circuit package and method and lead frame for making the package App 20020108769 - Glenn, Thomas P.	2002-08-15
Plastic integrated circuit package and method and leadframe for making the package Grant 6,433,277 - Glenn August 13, 2	2002-08-13
Active heat sink for cooling a semiconductor chip Grant 6,429,513 - Shermer, IV , et al. August 6, 2	2002-08-06
Method Of Forming An Integrated Circuit Device Package Using A Temporary Substrate App 20020100165 - Glenn , Thomas P.	2002-08-01
Semiconductor chip having a radio-frequency identification transceiver Grant 6,424,315 - Glenn , et al. July 23, 2	2002-07-23
Stackable package with heat sink Grant 6,424,031 - Glenn July 23, 2	2002-07-23
Method of making a plastic package for an optical integrated circuit device Grant 6,420,204 - Glenn July 16, 2	2002-07-16
Wafer level production of chip size semiconductor packages Grant 6,406,934 - Glenn , et al. June 18, 2	2002-06-18
Wafer scale image sensor package Grant 6,407,381 - Glenn , et al. June 18, 2	2002-06-18
Module of stacked integrated circuit packages including an interposer Grant 6,404,046 - Glenn , et al. June 11, 2	2002-06-11
Method for forming a reduced thickness packaged electronic device Grant 6,399,418 - Glenn , et al. June 4, 2	2002-06-04
Method of singulation using laser cutting Grant 6,399,463 - Glenn , et al. June 4, 2	2002-06-04
Thin image sensor package fabrication method Grant 6,396,043 - Glenn , et al. May 28, 2	2002-05-28
Method of fabricating image sensor packages in an array Grant 6,389,687 - Glenn , et al. May 21, 2	2002-05-21
Method of making an integrated circuit package App 20020038714 - Glenn, Thomas P.	2002-04-04
Plastic integrated circuit device package having exposed lead surface App 20020027010 - Glenn, Thomas P.	2002-03-07
Flip chip on glass image sensor package fabrication method Grant 6,342,406 - Glenn , et al. January 29, 2	2002-01-29
Making semiconductor packages with stacked dies and reinforced wire bonds Grant 6,340,846 - LoBianco , et al. January 22, 2	2002-01-22
Stackable package for an integrated circuit Grant 6,320,251 - Glenn November 20, 2	2001-11-20
Precision marking and singulation method Grant 6,309,943 - Glenn , et al. October 30, 2	2001-10-30
Chip-size semiconductor packages Grant 6,291,884 - Glenn , et al. September 18, 2	2001-09-18
Plastic integrated circuit device package and leadframe having partially undercut leads and die pad Grant 6,281,568 - Glenn , et al. August 28, 2	2001-08-28
Method Of Making A Plastic Pakage For An Optical Integrated Circuit Device App 20010014486 - Glenn, Thomas P.	2001-08-16
Plastic package for an optical integrated circuit device and method of making Grant 6,274,927 - Glenn August 14, 2	2001-08-14
Integrated circuit package having adhesive bead supporting planar lid above planar substrate Grant 6,268,654 - Glenn , et al. July 31, 2	2001-07-31
Molded window array for image sensor packages Grant 6,266,197 - Glenn , et al. July 24, 2	2001-07-24
Method of forming an integrated circuit device package using a plastic tape as a base Grant 6,247,229 - Glenn June 19, 2	2001-06-19
Electrostatic discharge protection package and method Grant 6,246,566 - Glenn June 12, 2	2001-06-12
Near chip size integrated circuit package Grant 6,228,676 - Glenn , et al. May 8, 2	2001-05-08
Flip-chip micromachine package fabrication method Grant 6,214,644 - Glenn April 10, 2	2001-04-10
RF shielded device Grant 6,150,193 - Glenn November 21, 2	2000-11-21
Plastic integrated circuit package and method and leadframe for making the package Grant 6,143,981 - Glenn November 7, 2	2000-11-07
Method of making an integrated circuit package employing a transparent encapsulant Grant 6,143,588 - Glenn November 7, 2	2000-11-07
Optical sensor array mounting and alignment Grant 6,117,193 - Glenn September 12, 2	2000-09-12
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate Grant 6,117,705 - Glenn , et al. September 12, 2	2000-09-12
Electromagnetic interference shield driver and method Grant 6,092,281 - Glenn July 25, 2	2000-07-25
Integrated circuit package Grant 6,034,429 - Glenn , et al. March 7, 2	2000-03-07
Near chip size integrated circuit package Grant 5,981,314 - Glenn , et al. November 9, 1	1999-11-09
Integrated circuit package employing a transparent encapsulant Grant 5,962,810 - Glenn October 5, 1	1999-10-05
Method of making an integrated circuit package Grant 5,950,074 - Glenn , et al. September 7, 1	1999-09-07
Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device Grant 5,949,655 - Glenn September 7, 1	1999-09-07
Shielded surface acoustical wave package Grant 5,939,784 - Glenn August 17, 1	1999-08-17
Mounting for a semiconductor integrated circuit device Grant 5,867,368 - Glenn February 2, 1	1999-02-02
Interdigitated wirebond programmable fixed voltage planes Grant 5,672,909 - Glenn , et al. September 30, 1	1997-09-30
Plastic packaged integrated circuit with heat spreader Grant 5,596,485 - Glenn , et al. January 21, 1	1997-01-21
Method of selectively soldering the underside of a substrate having leads Grant 4,684,055 - Baer , et al. August 4, 1	1987-08-04