Glenn; Max
Patent Applications and Registrations
Patent applications and USPTO patent grants for Glenn; Max.The latest application filed is for "mems bump pattern die alignment systems and methods".
- Glenn; Max - Chanhassen MN
- Glenn; Max - Morristown NJ
| Patent | Date |
|---|---|
| Multistage proof-mass movement deceleration within MEMS structures Grant 8,011,247 - Glenn September 6, 2 | 2011-09-06 |
| Saw debris reduction in MEMS devices Grant 7,977,786 - Ridley , et al. July 12, 2 | 2011-07-12 |
| Getter on die in an upper sense plate designed system Grant 7,800,190 - Seppala , et al. September 21, 2 | 2010-09-21 |
| Saw Debris Reduction In Mems Devices App 20100019364 - Ridley; Jeff A. ; et al. | 2010-01-28 |
| Mems Bump Pattern Die Alignment Systems And Methods App 20100020517 - Seppala; Bryan ; et al. | 2010-01-28 |
| Multistage Proof-mass Movement Deceleration Within Mems Structures App 20090320592 - Glenn; Max | 2009-12-31 |
| Getter On Die In An Upper Sense Plate Designed System App 20090309203 - Seppala; Bryan ; et al. | 2009-12-17 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 