loadpatents
Patent applications and USPTO patent grants for Gleixner; Robert J..The latest application filed is for "read cache for reset read disturb mitigation".
Patent | Date |
---|---|
Predicting and compensating for degradation of memory cells Grant 11,456,036 - Lu , et al. September 27, 2 | 2022-09-27 |
Error detection and correction in memory Grant 11,455,210 - McCrate , et al. September 27, 2 | 2022-09-27 |
Read Cache For Reset Read Disturb Mitigation App 20220270679 - Lu; Zhongyuan ;   et al. | 2022-08-25 |
Increase Of A Sense Current In Memory App 20220223203 - Lu; Zhongyuan ;   et al. | 2022-07-14 |
Write Operation Techniques For Memory Systems App 20220130444 - Lu; Zhongyuan ;   et al. | 2022-04-28 |
Increase Of A Sense Current In Memory App 20220108746 - Lu; Zhongyuan ;   et al. | 2022-04-07 |
Increase of a sense current in memory Grant 11,295,811 - Lu , et al. April 5, 2 | 2022-04-05 |
Increase Of A Sense Current In Memory App 20220068377 - Lu; Zhongyuan ;   et al. | 2022-03-03 |
Memory Electrodes And Formation Thereof App 20220069207 - McCrate; Joseph M. ;   et al. | 2022-03-03 |
Write operation techniques for memory systems Grant 11,244,717 - Lu , et al. February 8, 2 | 2022-02-08 |
Increase of a sense current in memory Grant 11,211,122 - Lu , et al. December 28, 2 | 2021-12-28 |
Write Operation Techniques For Memory Systems App 20210166746 - Lu; Zhongyuan ;   et al. | 2021-06-03 |
Wirebond structure and method to connect to a microelectronic die Grant 7,855,103 - Gleixner , et al. December 21, 2 | 2010-12-21 |
Chalcogenide anti-fuse App 20090180313 - Deweerd; Wim ;   et al. | 2009-07-16 |
Wirebond Structure And Method To Connect To A Microelectronic Die App 20080227285 - GLEIXNER; ROBERT J. ;   et al. | 2008-09-18 |
Wirebond structure and method to connect to a microelectronic die Grant 7,393,772 - Gleixner , et al. July 1, 2 | 2008-07-01 |
Wirebond structure and method to connect to a microelectronic die Grant 6,924,554 - Gleixner , et al. August 2, 2 | 2005-08-02 |
Wirebond structure and method to connect to a microelectronic die App 20050079651 - Gleixner, Robert J. ;   et al. | 2005-04-14 |
Wirebond structure and method to connect to a microelectronic die Grant 6,683,383 - Gleixner , et al. January 27, 2 | 2004-01-27 |
Wirebond structure and method to connect to a microelectronic die App 20030205827 - Gleixner, Robert J. ;   et al. | 2003-11-06 |
Wirebond structure and method to connect to a microelectronic die App 20030075804 - Gleixner, Robert J. ;   et al. | 2003-04-24 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.