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Patent applications and USPTO patent grants for Gladden; Warren K..The latest application filed is for "thermal monitoring and management of integrated circuits".
Patent | Date |
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Thermal monitoring and management of integrated circuits Grant 7,973,544 - Archer, III , et al. July 5, 2 | 2011-07-05 |
Thermal Monitoring And Management Of Integrated Circuits App 20100045326 - Archer, III; Vance D. ;   et al. | 2010-02-25 |
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink Grant 7,429,502 - Archer, III , et al. September 30, 2 | 2008-09-30 |
Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink Grant 7,327,029 - Archer, III , et al. February 5, 2 | 2008-02-05 |
Integrated Circuit Device Incorporating Metallurgical Bond to Enhance Thermal Conduction to a Heat Sink App 20080026508 - Archer; Vance D. III ;   et al. | 2008-01-31 |
Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink App 20070069368 - Archer; Vance D. III ;   et al. | 2007-03-29 |
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