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name:-0.026411056518555
name:-0.0013370513916016
Gisin; Franz Patent Filings

Gisin; Franz

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gisin; Franz.The latest application filed is for "simultaneous and selective partitioning of via structures using plating resist".

Company Profile
0.9.9
  • Gisin; Franz - San Jose CA
  • Gisin; Franz - Los Altos CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Stripline transmission lines with cross-hatched pattern return plane, where the striplines do not overlap any intersections in the cross-hatched pattern
Grant 10,757,800 - Bergman , et al. A
2020-08-25
Measuring complex PCB-based interconnects in a production environment
Grant 10,712,398 - Gisin
2020-07-14
Simultaneous and selective partitioning of via structures using plating resist
Grant 8,222,537 - Dudnikov, Jr. , et al. July 17, 2
2012-07-17
Substantially continuous layer of embedded transient protection for printed circuit boards
Grant 8,156,640 - Dudnikov, Jr. , et al. April 17, 2
2012-04-17
Substantially continuous layer of embedded transient protection for printed circuit boards
Grant 7,688,598 - Dudnikov, Jr. , et al. March 30, 2
2010-03-30
Simultaneous and Selective Partitioning of Via Structures Using Plating Resist
App 20090288874 - Dudnikov, JR.; George ;   et al.
2009-11-26
Selective deposition of embedded transient protection for printed circuit boards
Grant 7,593,203 - Dudnikov, Jr. , et al. September 22, 2
2009-09-22
Substantially Continuous Layer of Embedded Transient Protection For Printed Circuit Boards
App 20090025213 - Dudnikov, JR.; George ;   et al.
2009-01-29
Via stub termination structures and methods for making same
Grant 7,457,132 - Gisin , et al. November 25, 2
2008-11-25
Printed Circuit Boards And The Like With Improved Signal Integrity For Differential Signal Pairs
App 20070294890 - Gisin; Franz ;   et al.
2007-12-27
Method for optimizing high frequency performance of via structures
Grant 7,249,337 - Gisin , et al. July 24, 2
2007-07-24
Via stub termination structures and methods for making same
App 20070091581 - Gisin; Franz ;   et al.
2007-04-26
Simultaneous and selective partitioning of via structures using plating resist
App 20060199390 - Dudnikov; George JR. ;   et al.
2006-09-07
Substantially continuous layer of embedded transient protection for printed circuit boards
App 20060181826 - Dudnikov; George JR. ;   et al.
2006-08-17
Selective deposition of embedded transient protection for printed circuit boards
App 20060181827 - Dudnikov; George JR. ;   et al.
2006-08-17
Printed circuit boards and the like with improved signal integrity for differential signal pairs
App 20060151869 - Gisin; Franz ;   et al.
2006-07-13
Method for optimizing high frequency performance of via structures
App 20040176938 - Gisin, Franz ;   et al.
2004-09-09
Modular power management system with common EMC barrier
Grant 5,770,898 - Hannigan , et al. June 23, 1
1998-06-23

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