Gillett; Blake A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gillett; Blake A..The latest application filed is for "method of making a semiconductor package having exposed metal strap".

Company Profile

0.7.3

Gillett; Blake A. - Gilbert AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making a leadframe for semiconductor devices Grant 7,001,799 - Edwards , et al. February 21, 2	2006-02-21
Leadframe package for semiconductor devices Grant 6,844,615 - Edwards , et al. January 18, 2	2005-01-18
Leadframe package for semiconductor devices Grant 6,794,740 - Edwards , et al. September 21, 2	2004-09-21
Making two lead surface mounting high power microleadframe semiconductor packages Grant 6,756,658 - Gillett , et al. June 29, 2	2004-06-29
Method of making a semiconductor package having exposed metal strap Grant 6,723,582 - Glenn , et al. April 20, 2	2004-04-20
Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe Grant 6,707,138 - Crowley , et al. March 16, 2	2004-03-16
Method of making a semiconductor package having exposed metal strap App 20030113954 - Glenn, Thomas P. ; et al.	2003-06-19
Exposed copper strap in a semiconductor package Grant 6,566,164 - Glenn , et al. May 20, 2	2003-05-20
Packaging high power integrated circuit devices App 20030075785 - Crowley, Sean T. ; et al.	2003-04-24
Attaching semiconductor dies to substrates with conductive straps App 20020125562 - Crowley, Sean T. ; et al.	2002-09-12

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