| Patent | Date |
|---|
Wafer-level assembly method for semiconductor devices
App 20060012020 - Gilleo; Kenneth B. | 2006-01-19 |
Releasable microcapsule and adhesive curing system using the same
Grant 6,936,644 - Gilleo August 30, 2 | 2005-08-30 |
Electrical circuit assembly with improved shock resistance
App 20050056946 - Gilleo, Kenneth B. | 2005-03-17 |
Photon-conducting media alignment using a thermokinetic material
Grant 6,863,447 - Gilleo March 8, 2 | 2005-03-08 |
Reconnectable chip interface and chip package
App 20050012212 - Gilleo, Kenneth B. | 2005-01-20 |
Reconnectable chip interface and chip package
App 20050012191 - Gilleo, Kenneth B. | 2005-01-20 |
Via interconnect forming process and electronic component product thereof
Grant 6,838,372 - Gilleo January 4, 2 | 2005-01-04 |
MEMS device assembly
App 20040163717 - Gilleo, Kenneth B. | 2004-08-26 |
Package for microchips
App 20040108588 - Gilleo, Kenneth B. | 2004-06-10 |
Photon-conducting media alignment using a thermokinetic material
App 20040101252 - Gilleo, Kenneth B. | 2004-05-27 |
Releasable microcapsule and adhesive curing system using the same
App 20040074089 - Gilleo, Kenneth B. | 2004-04-22 |
Via interconnect forming process and electronic component product thereof
App 20040056345 - Gilleo, Kenneth B. | 2004-03-25 |
Compliant semiconductor chip assemblies and methods of making same
Grant 6,252,301 - Gilleo , et al. June 26, 2 | 2001-06-26 |
Microelectronic component mounting with deformable shell terminals
Grant 6,204,455 - Gilleo , et al. March 20, 2 | 2001-03-20 |
Compliant semiconductor chip assemblies and methods of making same
Grant 6,020,220 - Gilleo , et al. February 1, 2 | 2000-02-01 |
Microelectronic component mounting with deformable shell terminals
Grant 5,971,253 - Gilleo , et al. October 26, 1 | 1999-10-26 |
Method of manufacturing a multilayer electronic circuit
Grant 5,727,310 - Casson , et al. * March 17, 1 | 1998-03-17 |
Multilayer electronic circuit having a conductive adhesive
Grant 5,688,584 - Casson , et al. November 18, 1 | 1997-11-18 |
Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials
Grant 5,637,176 - Gilleo , et al. June 10, 1 | 1997-06-10 |
Method of making electroconductive adhesive particles for Z-axis application
Grant 5,531,942 - Gilleo , et al. July 2, 1 | 1996-07-02 |
Method for electrically and mechanically connecting at least two conductive layers
Grant 5,502,889 - Casson , et al. April 2, 1 | 1996-04-02 |
Method of forming interface between die and chip carrier
Grant 5,477,611 - Sweis , et al. December 26, 1 | 1995-12-26 |
Low temperature cure having single component conductive adhesive
Grant 4,747,968 - Gilleo May 31, 1 | 1988-05-31 |
Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
Grant 4,747,211 - Gilleo , et al. May 31, 1 | 1988-05-31 |
Boss formation using low surface energy dams
Grant 4,409,264 - Gilleo , et al. October 11, 1 | 1983-10-11 |
Method for forming a boss upon a thermoplastic polymer surface and resulting article
Grant 4,353,858 - Gilleo , et al. October 12, 1 | 1982-10-12 |
Nylon flame retardants based on certain organic acids
Grant 3,943,100 - Berenbaum , et al. March 9, 1 | 1976-03-09 |
Organic polymer flame retardants based on sulfamide
Grant 3,915,931 - Gilleo , et al. October 28, 1 | 1975-10-28 |
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