Patent | Date |
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Method and structure for determining thermal cycle reliability Grant 9,443,776 - Filippi , et al. September 13, 2 | 2016-09-13 |
Method And Structure For Determining Thermal Cycle Reliability App 20150262899 - FILIPPI; RONALD G. ;   et al. | 2015-09-17 |
Micro-electro-mechanical-system temperature sensor Grant 8,480,302 - Gill , et al. July 9, 2 | 2013-07-09 |
Micro-electro-mechanical-system Temperature Sensor App 20120076172 - Gill; Jason P. ;   et al. | 2012-03-29 |
Low leakage metal-containing cap process using oxidation Grant 7,867,897 - Gambino , et al. January 11, 2 | 2011-01-11 |
Via bottom contact and method of manufacturing same Grant 7,830,019 - Chanda , et al. November 9, 2 | 2010-11-09 |
Structure for modeling stress-induced degradation of conductive interconnects Grant 7,692,439 - Chanda , et al. April 6, 2 | 2010-04-06 |
Low Leakage Metal-containing Cap Process Using Oxidation App 20100021656 - Gambino; Jeffrey P. ;   et al. | 2010-01-28 |
Structure for monitoring stress-induced degradation of conductive interconnects Grant 7,639,032 - Chanda , et al. December 29, 2 | 2009-12-29 |
Low leakage metal-containing cap process using oxidation Grant 7,598,614 - Gambino , et al. October 6, 2 | 2009-10-06 |
VIA bottom contact and method of manufacturing same Grant 7,585,764 - Chanda , et al. September 8, 2 | 2009-09-08 |
Via Bottom Contact And Method Of Manufacturing Same App 20090200673 - Chanda; Kaushik ;   et al. | 2009-08-13 |
Enhancement of performance of a conductive wire in a multilayered substrate Grant 7,511,378 - Gill , et al. March 31, 2 | 2009-03-31 |
Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime Grant 7,500,208 - Chen , et al. March 3, 2 | 2009-03-03 |
Structure for modeling stress-induced degradation of conductive interconnects App 20080231312 - Chanda; Kaushik ;   et al. | 2008-09-25 |
Programmable Resistor, Switch Or Vertical Memory Cell App 20080173975 - Chen; Fen ;   et al. | 2008-07-24 |
Structure and method for monitoring stress-induced degradation of conductive interconnects Grant 7,397,260 - Chanda , et al. July 8, 2 | 2008-07-08 |
Method for monitoring stress-induced degradation of conductive interconnects App 20080107149 - Chanda; Kaushik ;   et al. | 2008-05-08 |
Low Leakage Metal-containing Cap Process Using Oxidation App 20070235875 - Gambino; Jeffrey P. ;   et al. | 2007-10-11 |
Contact Via Scheme With Staggered Vias App 20070176295 - Chinthakindi; Anil K. ;   et al. | 2007-08-02 |
Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits Grant 7,231,617 - Chen , et al. June 12, 2 | 2007-06-12 |
Non-destructive Evaluation Of Microstructure And Interface Roughness Of Electrically Conducting Lines In Semiconductor Integrated Circuits In Deep Sub-micron Regime App 20070130551 - Chen; Fen ;   et al. | 2007-06-07 |
Structure And Method For Monitoring Stress-induced Degradation Of Conductive Interconnects App 20070115018 - Chanda; Kaushik ;   et al. | 2007-05-24 |
Via Bottom Contact And Method Of Manufacturing Same App 20070037403 - Chanda; Kaushik ;   et al. | 2007-02-15 |
Structure and method for local resistor element in integrated circuit technology Grant 7,166,904 - Gill , et al. January 23, 2 | 2007-01-23 |
Enhancement of performance of a conductive wire in a multilayered substrate App 20060226142 - Gill; Jason P. ;   et al. | 2006-10-12 |
Enhancement of performance of a conductive wire in a multilayered substrate Grant 7,096,450 - Gill , et al. August 22, 2 | 2006-08-22 |
Non-destructive Evaluation Of Microstructure And Interface Roughness Of Electrically Conducting Lines In Semiconductor Integrated Circuits In Deep Sub-micron Regime App 20060071676 - Chen; Fen ;   et al. | 2006-04-06 |
Structure And Method For Local Resistor Element In Integrated Circuit Technology App 20050167786 - Gill, Jason P. ;   et al. | 2005-08-04 |
Enhancement Of Performance Of A Conductive Wire In A Multilayered Substrate App 20040262031 - Gill, Jason P. ;   et al. | 2004-12-30 |