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Patent applications and USPTO patent grants for GILBERT; Scott A..The latest application filed is for "method for orienting solder balls on a bga device".
Patent | Date |
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Method For Orienting Solder Balls On A Bga Device App 20210185830 - HOSSAIN; MD Altaf ;   et al. | 2021-06-17 |
Method for orienting solder balls on a BGA device Grant 10,980,134 - Hossain , et al. April 13, 2 | 2021-04-13 |
Method For Orienting Solder Balls On A Bga Device App 20190230795 - HOSSAIN; MD Altaf ;   et al. | 2019-07-25 |
Land side and die side cavities to reduce package z-height Grant 10,297,542 - Hossain , et al. | 2019-05-21 |
Method for orienting solder balls on a BGA device Grant 10,278,292 - Hossain , et al. | 2019-04-30 |
Land side and die side cavities to reduce package z-height Grant 9,799,556 - Hossain , et al. October 24, 2 | 2017-10-24 |
Land side and die side cavities to reduce package z-height Grant 9,721,882 - Hossain , et al. August 1, 2 | 2017-08-01 |
Land Side And Die Side Cavities To Reduce Package Z-height App 20160181145 - Hossain; MD Altaf ;   et al. | 2016-06-23 |
Bga Structure Using Ctf Balls In High Stress Regions App 20160128207 - Hossain; MD Altaf ;   et al. | 2016-05-05 |
Land side and die side cavities to reduce package Z-height Grant 9,293,426 - Hossain , et al. March 22, 2 | 2016-03-22 |
BGA structure using CTF balls in high stress regions Grant 9,237,659 - Hossain , et al. January 12, 2 | 2016-01-12 |
Bga Structure Using Ctf Balls In High Stress Regions App 20140092572 - Hossain; MD Altaf ;   et al. | 2014-04-03 |
Land Side And Die Side Cavities To Reduce Package Z-height App 20140091428 - Hossain; MD Altaf ;   et al. | 2014-04-03 |
Non-solder Metal Bumps To Reduce Package Height App 20120161312 - HOSSAIN; Md Altaf ;   et al. | 2012-06-28 |
Making electrical connections between a circuit board and an integrated circuit Grant 7,241,147 - Lloyd , et al. July 10, 2 | 2007-07-10 |
Making electrical connections between a circuit board and an integrated circuit App 20050227509 - Lloyd, Shawn L. ;   et al. | 2005-10-13 |
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