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name:-0.011033058166504
name:-0.011530160903931
name:-0.0015449523925781
GILBERT; Scott A. Patent Filings

GILBERT; Scott A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for GILBERT; Scott A..The latest application filed is for "method for orienting solder balls on a bga device".

Company Profile
1.10.10
  • GILBERT; Scott A. - Chandler AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Orienting Solder Balls On A Bga Device
App 20210185830 - HOSSAIN; MD Altaf ;   et al.
2021-06-17
Method for orienting solder balls on a BGA device
Grant 10,980,134 - Hossain , et al. April 13, 2
2021-04-13
Method For Orienting Solder Balls On A Bga Device
App 20190230795 - HOSSAIN; MD Altaf ;   et al.
2019-07-25
Land side and die side cavities to reduce package z-height
Grant 10,297,542 - Hossain , et al.
2019-05-21
Method for orienting solder balls on a BGA device
Grant 10,278,292 - Hossain , et al.
2019-04-30
Land side and die side cavities to reduce package z-height
Grant 9,799,556 - Hossain , et al. October 24, 2
2017-10-24
Land side and die side cavities to reduce package z-height
Grant 9,721,882 - Hossain , et al. August 1, 2
2017-08-01
Land Side And Die Side Cavities To Reduce Package Z-height
App 20160181145 - Hossain; MD Altaf ;   et al.
2016-06-23
Bga Structure Using Ctf Balls In High Stress Regions
App 20160128207 - Hossain; MD Altaf ;   et al.
2016-05-05
Land side and die side cavities to reduce package Z-height
Grant 9,293,426 - Hossain , et al. March 22, 2
2016-03-22
BGA structure using CTF balls in high stress regions
Grant 9,237,659 - Hossain , et al. January 12, 2
2016-01-12
Bga Structure Using Ctf Balls In High Stress Regions
App 20140092572 - Hossain; MD Altaf ;   et al.
2014-04-03
Land Side And Die Side Cavities To Reduce Package Z-height
App 20140091428 - Hossain; MD Altaf ;   et al.
2014-04-03
Non-solder Metal Bumps To Reduce Package Height
App 20120161312 - HOSSAIN; Md Altaf ;   et al.
2012-06-28
Making electrical connections between a circuit board and an integrated circuit
Grant 7,241,147 - Lloyd , et al. July 10, 2
2007-07-10
Making electrical connections between a circuit board and an integrated circuit
App 20050227509 - Lloyd, Shawn L. ;   et al.
2005-10-13

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