loadpatents
name:-0.019422054290771
name:-0.016252994537354
name:-0.0023109912872314
Gignac; Lynne M. Patent Filings

Gignac; Lynne M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gignac; Lynne M..The latest application filed is for "crystalline film of carbon nanotubes".

Company Profile
2.18.16
  • Gignac; Lynne M. - Beacon NY
  • Gignac; Lynne M. - Yorktown Heights NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Non-destructive determination of components of integrated circuits
Grant 10,386,409 - Gignac , et al. A
2019-08-20
Crystalline Film Of Carbon Nanotubes
App 20190248654 - Falk; Abram L. ;   et al.
2019-08-15
Non-destructive Determination Of Components Of Integrated Circuits
App 20170074927 - Gignac; Lynne M. ;   et al.
2017-03-16
Discontinuous/non-uniform metal cap structure and process for interconnect integration
Grant 8,889,546 - Yang , et al. November 18, 2
2014-11-18
System involving electrically reprogrammable fuses
Grant 8,866,257 - Chanda , et al. October 21, 2
2014-10-21
Discontinuous/non-uniform metal cap structure and process for interconnect integration
Grant 8,823,176 - Yang , et al. September 2, 2
2014-09-02
System Involving Electrically Reprogrammable Fuses
App 20140177373 - Chanda; Kaushik ;   et al.
2014-06-26
Methods and systems involving electrically reprogrammable fuses
Grant 8,716,071 - Chanda , et al. May 6, 2
2014-05-06
Structure and process for conductive contact integration
Grant 8,679,970 - Yang , et al. March 25, 2
2014-03-25
Methods and systems involving electrically reprogrammable fuses
Grant 8,535,991 - Chanda , et al. September 17, 2
2013-09-17
Methods And Systems Involving Electrically Reprogrammable Fuses
App 20130176805 - Chanda; Kaushik ;   et al.
2013-07-11
Discontinuous/non-uniform Metal Cap Structure And Process For Interconnect Integration
App 20120329271 - Yang; Chih-Chao ;   et al.
2012-12-27
Efficient interconnect structure for electrical fuse applications
Grant 8,133,767 - Yang , et al. March 13, 2
2012-03-13
Efficient Interconnect Structure For Electrical Fuse Applications
App 20110092031 - Yang; Chih-Chao ;   et al.
2011-04-21
Efficient interconnect structure for electrical fuse applications
Grant 7,893,520 - Yang , et al. February 22, 2
2011-02-22
Methods and Systems Involving Electrically Reprogrammable Fuses
App 20100118636 - Chanda; Kaushik ;   et al.
2010-05-13
Discontinuous/non-uniform Metal Cap Structure And Process For Interconnect Integration
App 20100084767 - Yang; Chih-Chao ;   et al.
2010-04-08
Structure And Process For Conductive Contact Integration
App 20090289365 - Yang; Chih-Chao ;   et al.
2009-11-26
Efficient Interconnect Structure For Electrical Fuse Applications
App 20090278229 - Yang; Chih-Chao ;   et al.
2009-11-12
Methods And Systems Involving Electrically Reprogrammable Fuses
App 20090045484 - Chanda; Kaushik ;   et al.
2009-02-19
Method for SEM measurement of features using magnetically filtered low loss electron microscopy
App 20070029479 - Gignac; Lynne M. ;   et al.
2007-02-08
Method Of Forming Images In A Scanning Electron Microscope
App 20060169894 - Gignac; Lynne M. ;   et al.
2006-08-03
Method for plating copper conductors and devices formed
Grant 6,979,393 - Rodbell , et al. December 27, 2
2005-12-27
Diffusion barrier layer and semiconductor device containing same
Grant 6,784,485 - Cohen , et al. August 31, 2
2004-08-31
Method for SEM measurement of topological features
Grant 6,768,111 - Wells , et al. July 27, 2
2004-07-27
Apparatus and method for forming uniformly thick anodized films on large substrates
App 20040077140 - Andricacos, Panayotis C. ;   et al.
2004-04-22
Method for producing a flat interface for a metal-silicon contact barrier film
App 20020180046 - Wang, Yun-Yu ;   et al.
2002-12-05
Method for plating copper conductors and devices formed
App 20020066673 - Rodbell, Kenneth P. ;   et al.
2002-06-06
Method for plating copper conductors and devices formed
Grant 6,344,129 - Rodbell , et al. February 5, 2
2002-02-05
Method for forming an atomically flat interface for a highly disordered metal-silicon barrier film
Grant 6,022,801 - Domenicucci , et al. February 8, 2
2000-02-08

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