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Patent applications and USPTO patent grants for Gibbs; Byron Harry.The latest application filed is for "hyperbaric saw for sawing packaged devices".
Patent | Date |
---|---|
Hyperbaric Saw For Sawing Packaged Devices App 20220208571 - Gibbs; Byron Harry ;   et al. | 2022-06-30 |
Testing Semiconductor Components App 20220108896 - TUNCER; Enis ;   et al. | 2022-04-07 |
Testing semiconductor components Grant 11,201,065 - Tuncer , et al. December 14, 2 | 2021-12-14 |
Testing Semiconductor Components App 20210134610 - TUNCER; Enis ;   et al. | 2021-05-06 |
Thermal pad shorts test for wire bonded strip testing Grant 8,994,397 - Gibbs , et al. March 31, 2 | 2015-03-31 |
Contactor with multi-pin device contacts Grant 8,912,810 - Hsu , et al. December 16, 2 | 2014-12-16 |
Thermal Pad Shorts Test For Wire Bonded Strip Testing App 20130120019 - GIBBS; BYRON HARRY ;   et al. | 2013-05-16 |
Contactor With Multi-pin Device Contacts App 20130063172 - HSU; STANLEY ;   et al. | 2013-03-14 |
Contact mechanism cleaning Grant 7,474,089 - Gibbs , et al. January 6, 2 | 2009-01-06 |
Contact mechanism cleaning App 20080156352 - Gibbs; Byron Harry ;   et al. | 2008-07-03 |
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