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Patent applications and USPTO patent grants for GEYIK; Cemil.The latest application filed is for "interconnect loss of high density package with magnetic material".
Patent | Date |
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Interconnect Loss Of High Density Package With Magnetic Material App 20210104476 - QIAN; Zhiguo ;   et al. | 2021-04-08 |
Scalable High Speed High Bandwidth Io Signaling Package Architecture And Method Of Making App 20210028116 - GANESAN; Sanka ;   et al. | 2021-01-28 |
Trace modulations in connectors for integrated-circuit packages Grant 10,840,196 - Geyik , et al. November 17, 2 | 2020-11-17 |
Copper Interface Features For High Speed Interconnect Applications App 20200315023 - NAD; Suddhasattwa ;   et al. | 2020-10-01 |
Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby Grant 10,303,225 - Aygun , et al. | 2019-05-28 |
Methods Of Forming Hybrid Socket Structures For Package Interconnect Applications And Structures Formed Thereby App 20190101961 - Aygun; Kemal ;   et al. | 2019-04-04 |
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