Geyer; Harry J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Geyer; Harry J..The latest application filed is for "methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot".

Company Profile

0.9.1

Geyer; Harry J. - Kalispell MT
Geyer; Harry J. - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Contact assembly for supplying power to workpieces during electrochemical processing Grant 6,805,778 - Batz, Jr. , et al. October 19, 2	2004-10-19
Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot App 20040035707 - Batz, Robert W. JR. ; et al.	2004-02-26
Semiconductor chip package and method of forming Grant 5,467,253 - Heckman , et al. November 14, 1	1995-11-14
Apparatus for tape automated bonding Grant 5,232,144 - Carney , et al. August 3, 1	1993-08-03
Data device module having locking groove Grant 4,943,708 - Simmons , et al. July 24, 1	1990-07-24
Metallization scheme providing adhesion and barrier properties Grant 4,927,505 - Sharma , et al. May 22, 1	1990-05-22
Metallization scheme providing adhesion and barrier properties Grant 4,880,708 - Sharma , et al. November 14, 1	1989-11-14
Bonding method and apparatus Grant 4,795,077 - Geyer , et al. January 3, 1	1989-01-03
Integrated circuit device employing metal frame means with preformed conductor means Grant 4,003,073 - Helda , et al. January 11, 1	1977-01-11
Contact Bonding And Packaging Of Integrated Circuits Grant 3,698,074 - Helda , et al. October 17, 1	1972-10-17

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