Gettinger; Constance L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gettinger; Constance L..The latest application filed is for "wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold".
- Gettinger; Constance L. - Chandler AZ
- Gettinger; Constance L. - Minneapolis MN
| Patent | Date |
|---|---|
| Wire-bonded Package With Electrically Insulating Wire Encapsulant And Thermally Conductive Overmold App 20080061447 - Matayabas; J. Christopher JR. ; et al. | 2008-03-13 |
| Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold Grant 7,332,797 - Matayabas, Jr. , et al. February 19, 2 | 2008-02-19 |
| Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold Grant 7,141,454 - Matayabas, Jr. , et al. November 28, 2 | 2006-11-28 |
| Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold App 20040266068 - Matayabas, J. Christopher JR. ; et al. | 2004-12-30 |
| Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold App 20040262749 - Matayabas, J. Christopher JR. ; et al. | 2004-12-30 |
| Low density dielectric having low microwave loss Grant 6,562,448 - Chamberlain , et al. May 13, 2 | 2003-05-13 |
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