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Patent applications and USPTO patent grants for Gerbsch; Erich William.The latest application filed is for "electrically isolated and thermally conductive double-sided pre-packaged component".
Patent | Date |
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Electrically isolated and thermally conductive double-sided pre-packaged component Grant 7,095,098 - Gerbsch , et al. August 22, 2 | 2006-08-22 |
Electrically isolated and thermally conductive double-sided pre-packaged component App 20050035442 - Gerbsch, Erich William ;   et al. | 2005-02-17 |
Electrically isolated and thermally conductive double-sided pre-packaged component Grant 6,812,553 - Gerbsch , et al. November 2, 2 | 2004-11-02 |
Electrically isolated and thermally conductive double-sided pre-packaged component App 20030132511 - Gerbsch, Erich William ;   et al. | 2003-07-17 |
Interconnect Assembly For An Electronic Assembly And Assembly Method Therefor App 20020106912 - Gerbsch, Erich William | 2002-08-08 |
Parallel dual switch module Grant 6,054,765 - Eytcheson , et al. April 25, 2 | 2000-04-25 |
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