Gerbsch; Erich W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gerbsch; Erich W..The latest application filed is for "liquid cooled electronics assembly suitable to use electrically conductive coolant".

Company Profile

0.10.13

Gerbsch; Erich W. - Cicero IN
Gerbsch; Erich W - Cicero IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid cooled electronics assembly suitable to use electrically conductive coolant Grant 8,699,225 - Brandenburg , et al. April 15, 2	2014-04-15
Liquid Cooled Electronics Assembly Suitable To Use Electrically Conductive Coolant App 20130258592 - BRANDENBURG; SCOTT D. ; et al.	2013-10-03
Semiconductor power module with flexible circuit leadframe Grant 7,960,817 - Gerbsch , et al. June 14, 2	2011-06-14
Fluid cooled semiconductor power module having double-sided cooling Grant 7,834,448 - Gerbsch November 16, 2	2010-11-16
Dual-sided Substate Integrated Circuit Package Including A Leadframe Having Leads With Increased Thickness App 20100133672 - MOCK; ROGER A. ; et al.	2010-06-03
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness Grant 7,697,303 - Mock , et al. April 13, 2	2010-04-13
Power semiconductor package having integral fluid cooling Grant 7,538,425 - Myers , et al. May 26, 2	2009-05-26
Fluid cooled semiconductor power module having double-sided cooling App 20090057882 - Gerbsch; Erich W.	2009-03-05
Semiconductor power module with flexible circuit leadframe App 20090057853 - Gerbsch; Erich W. ; et al.	2009-03-05
Ultra-thick thick film on ceramic substrate App 20090001546 - Flederbach; Lynda G. ; et al.	2009-01-01
Vertical laminated electrical switch circuit Grant 7,423,332 - Gerbsch , et al. September 9, 2	2008-09-09
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness App 20080198568 - Mock; Roger A. ; et al.	2008-08-21
Electronics assembly having multiple side cooling and method Grant 7,295,433 - Taylor , et al. November 13, 2	2007-11-13
Electronics assembly having multiple side cooling and method App 20070097627 - Taylor; Ralph S. ; et al.	2007-05-03
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness App 20070069348 - Mock; Roger A. ; et al.	2007-03-29
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness Grant 7,148,564 - Mock , et al. December 12, 2	2006-12-12
Power semiconductor package having integral fluid cooling App 20060022334 - Myers; Bruce A. ; et al.	2006-02-02
Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness App 20050179123 - Mock, Roger A. ; et al.	2005-08-18
Vertical laminated electrical switch circuit App 20050047186 - Gerbsch, Erich W. ; et al.	2005-03-03
Double-sided Multi-chip Circuit Component App 20040094828 - Campbell, Robert J. ; et al.	2004-05-20
Automotive electronics heat exchanger Grant 6,639,798 - Jeter , et al. October 28, 2	2003-10-28

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