George; Anna M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for George; Anna M..The latest application filed is for "methods of processing thick ild layers using spray coating or lamination for c4 wafer level thick metal integrated flow".

Company Profile

0.8.15

George; Anna M. - Sunnyvale CA
George; Anna M. - Phoenix AZ
George, Anna M. - US
George; Anna M. - Mountain View CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow App 20070190776 - Kim; Sarah E. ; et al.	2007-08-16
Thick metal layer integrated process flow to improve power delivery and mechanical buffering App 20060076678 - Kim; Sarah E. ; et al.	2006-04-13
Forming vertically aligned liquid crystal mixtures App 20060068518 - George; Anna M.	2006-03-30
Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow App 20060012039 - Kim; Sarah E. ; et al.	2006-01-19
Healing of micro-cracks in an on-chip dielectric Grant 6,975,017 - Towle , et al. December 13, 2	2005-12-13
Wafer-level Thick Film Standing-wave Clocking App 20050266675 - Braunisch, Henning ; et al.	2005-12-01
Wafer support and release in wafer processing App 20050221598 - Lu, Daoqiang ; et al.	2005-10-06
Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow Grant 6,943,440 - Kim , et al. September 13, 2	2005-09-13
Wafer-level thick film standing-wave clocking Grant 6,927,496 - Braunisch , et al. August 9, 2	2005-08-09
Package substrate pattern to accommodate optical waveguide App 20050161789 - Towle, Steven ; et al.	2005-07-28
Underfill integration for optical packages App 20050127528 - Lu, Daoqiang ; et al.	2005-06-16
Wafer-level thick film standing-wave clocking App 20050070087 - Braunisch, Henning ; et al.	2005-03-31
Thick metal layer integrated process flow to improve power delivery and mechanical buffering App 20050051894 - Kim, Sarah E. ; et al.	2005-03-10
Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow App 20050051904 - Kim, Sarah E. ; et al.	2005-03-10
Healing of micro-cracks in an on-chip dielectric App 20050023565 - Towle, Steven N. ; et al.	2005-02-03
Underfill integration for optical packages App 20040266062 - Lu, Daoqiang ; et al.	2004-12-30
Optoelectronic packages and methods to simultaneously couple an optoelectronic chip to a waveguide and substrate Grant 6,834,133 - Towle , et al. December 21, 2	2004-12-21
Healing of micro-cracks in an on-chip dielectric Grant 6,806,168 - Towle , et al. October 19, 2	2004-10-19
Polycarbosilane adhesion promoters for low dielectric constant polymeric materials Grant 6,780,517 - Chen , et al. August 24, 2	2004-08-24
Polycarbosilane adhesion promoters for low dielectric constant polymeric materials Grant 6,761,975 - Chen , et al. July 13, 2	2004-07-13
Healing of micro-cracks in an on-chip dielectric App 20040099877 - Towle, Steven N. ; et al.	2004-05-27
Polycarbosilane adhesion promoters for low dielectric constant polymeric materials App 20020198353 - Chen, Tian-An ; et al.	2002-12-26
Method for cleaning semiconductor wafers containing dielectric films Grant 6,152,148 - George , et al. November 28, 2	2000-11-28

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