Geiss; Erik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Geiss; Erik.The latest application filed is for "asymmetric overlay mark for overlay measurement".

Company Profile

4.8.8

Geiss; Erik - Mechanicville NY
Geiss; Erik - Saratoga Springs NY US
Geiss; Erik - Dresden N/A DE
Geiss; Erik - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Asymmetric overlay mark for overlay measurement Grant 10,707,175 - Zhao , et al.	2020-07-07
Asymmetric Overlay Mark For Overlay Measurement App 20190363053 - Zhao; Wei ; et al.	2019-11-28
Scaled memory structures or other logic devices with middle of the line cuts Grant 10,475,890 - Wang , et al. Nov	2019-11-12
Scaled Memory Structures Or Other Logic Devices With Middle Of The Line Cuts App 20190109197 - WANG; Haiting ; et al.	2019-04-11
Methods for fabricating FinFET integrated circuits with simultaneous formation of local contact openings Grant 9,397,004 - Bouche , et al. July 19, 2	2016-07-19
Methods For Fabricating Finfet Integrated Circuits With Simultaneous Formation Of Local Contact Openings App 20150214113 - Bouche; Guillaume ; et al.	2015-07-30
Method of forming self-aligned contacts for a semiconductor device Grant 8,927,407 - Baars , et al. January 6, 2	2015-01-06
Method of forming a semiconductor device by using sacrificial gate electrodes and sacrificial self-aligned contact structures Grant 8,614,123 - Wei , et al. December 24, 2	2013-12-24
Method of Forming Self-Aligned Contacts for a Semiconductor Device App 20130189833 - Baars; Peter ; et al.	2013-07-25
Method of Forming a Semiconductor Device by Using Sacrificial Gate Electrodes and Sacrificial Self-Aligned Contact Structures App 20130137257 - Wei; Andy ; et al.	2013-05-30
Two step optical planarizing layer etch Grant 7,601,641 - Geiss , et al. October 13, 2	2009-10-13
Two Step Optical Planarizing Layer Etch App 20090246959 - GEISS; Erik ; et al.	2009-10-01

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