Gehl; Bernhard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gehl; Bernhard.The latest application filed is for "method for closing openings in a flexible diaphragm of a mems element".

Company Profile

11.15.15

Gehl; Bernhard - Wannweil DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Closing Openings In A Flexible Diaphragm Of A Mems Element App 20210229983 - Gehl; Bernhard ; et al.	2021-07-29
MEMS microphone system Grant 11,012,789 - Hermes , et al. May 18, 2	2021-05-18
MEMS transducer system for pressure and acoustic sensing Grant 10,981,777 - Doller , et al. April 20, 2	2021-04-20
System of non-acoustic sensor combined with MEMS microphone Grant 10,934,160 - Doller , et al. March 2, 2	2021-03-02
Method for producing thin MEMS wafers Grant 10,793,430 - Loiseau , et al. October 6, 2	2020-10-06
MEMS microphone system having an electrode assembly Grant 10,555,088 - Meisel , et al. Fe	2020-02-04
Microphone with encapsulated moving electrode Grant 10,555,090 - Reinmuth , et al. Fe	2020-02-04
MEMS Transducer System for Pressure and Acoustic Sensing App 20190389721 - Doller; Andrew ; et al.	2019-12-26
System of Non-Acoustic Sensor Combined with MEMS Microphone App 20190352176 - Doller; Andrew ; et al.	2019-11-21
MEMS microphone system and method Grant 10,349,188 - Meisel , et al. July 9, 2	2019-07-09
MEMS Microphone System and Method App 20190116429 - Meisel; Daniel C. ; et al.	2019-04-18
Method For Producing Thin Mems Wafers App 20190092631 - Loiseau; Sebastien ; et al.	2019-03-28
MEMS Microphone System App 20190098418 - Hermes; Christoph ; et al.	2019-03-28
MEMS pressure sensor with multiple membrane electrodes Grant 10,183,857 - Graham , et al. Ja	2019-01-22
Microphone with Encapsulated Moving Electrode App 20180352341 - Reinmuth; Jochen ; et al.	2018-12-06
MEMS Microphone System having an Electrode Assembly App 20180146296 - Meisel; Daniel ; et al.	2018-05-24
Method for manufacturing a microphone structure and a pressure sensor structure in the layer structure of a MEMS element Grant 9,758,369 - Schoen , et al. September 12, 2	2017-09-12
Capacitive MEMS-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes Grant 9,725,300 - Stahl , et al. August 8, 2	2017-08-08
Method for manufacturing a microphone structure and a pressure sensor structure in the layer structure of a mems element App 20160304336 - Schoen; Florian ; et al.	2016-10-20
Capacitive Mems-sensor Element Having Bond Pads For The Electrical Contacting Of The Measuring Capacitor Electrodes App 20160280534 - Stahl; Heiko ; et al.	2016-09-29
MEMS membrane overtravel stop Grant 9,369,804 - Buck , et al. June 14, 2	2016-06-14
MEMS Membrane Overtravel Stop App 20160029126 - Buck; Thomas ; et al.	2016-01-28
Component having a micromechanical microphone structure, and method for manufacturing same Grant 9,042,581 - Zoellin , et al. May 26, 2	2015-05-26
Microphone component Grant 9,035,307 - Gehl , et al. May 19, 2	2015-05-19
Microphone Component App 20140191233 - GEHL; Bernhard ; et al.	2014-07-10
Mems Pressure Sensor With Multiple Membrane Electrodes App 20140054731 - Graham; Andrew ; et al.	2014-02-27
Component Having A Micromechanical Microphone Structure, And Method For Manufacturing Same App 20130010989 - Zoellin; Jochen ; et al.	2013-01-10

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