Geffken; Robert M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Geffken; Robert M..The latest application filed is for "metal spacer in single and dual damascene processing".
Company Profile
0.28.18
- Geffken; Robert M. - Burlington VT
- Geffken; Robert M - Burlington VT
Patent Activity
| Patent | Date |
|---|---|
| Dual damascene integration structure and method for forming improved dual damascene integration structure Grant 7,759,251 - Geffken , et al. July 20, 2 | 2010-07-20 |
| Metal spacer in single and dual damascene processing Grant 7,655,547 - Cooney, III , et al. February 2, 2 | 2010-02-02 |
| Metal Spacer In Single And Dual Damascene Processing App 20080293242 - Cooney, III; Edward C. ; et al. | 2008-11-27 |
| Sacrificial Metal Spacer Dual Damascene App 20080203579 - Cooney; Edward C. ; et al. | 2008-08-28 |
| Sacrificial metal spacer damascene process Grant 7,393,777 - Cooney, III , et al. July 1, 2 | 2008-07-01 |
| Metal spacer in single and dual damascence processing Grant 7,381,637 - Cooney, III , et al. June 3, 2 | 2008-06-03 |
| Adjustable self-aligned air gap dielectric for low capacitance wiring Grant 7,358,148 - Geffken , et al. April 15, 2 | 2008-04-15 |
| Full Removal Of Dual Damascene Metal Level App 20070275565 - Cooney; Edward C. III ; et al. | 2007-11-29 |
| Copper interconnect wiring and method of forming thereof Grant 7,291,558 - Geffken , et al. November 6, 2 | 2007-11-06 |
| Adjustable self-aligned air gap dielectric for low capacitance wiring App 20060202302 - Geffken; Robert M. ; et al. | 2006-09-14 |
| Adjustable self-aligned air gap dielectric for low capacitance wiring Grant 7,071,532 - Geffken , et al. July 4, 2 | 2006-07-04 |
| Copper interconnect wiring and method of forming thereof App 20060105570 - Hautala; John J. ; et al. | 2006-05-18 |
| Single and multilevel rework Grant 6,982,227 - Cooney, III , et al. January 3, 2 | 2006-01-03 |
| Dual damascene integration structure and method for forming improved dual damascene integration structure App 20050272265 - Geffken, Robert M. ; et al. | 2005-12-08 |
| Contact capping local interconnect Grant 6,939,791 - Geffken , et al. September 6, 2 | 2005-09-06 |
| Metal spacer in single and dual damascene processing App 20050146040 - Cooney, Edward C. III ; et al. | 2005-07-07 |
| Metal spacer in single and dual damascene processing Grant 6,888,251 - Cooney, III , et al. May 3, 2 | 2005-05-03 |
| Sacrificial metal spacer damascene process App 20050085064 - Cooney, Edward C. III ; et al. | 2005-04-21 |
| Adjustable Self-aligned Air Gap Dielectric For Low Capacitance Wiring App 20050067673 - Geffken, Robert M. ; et al. | 2005-03-31 |
| Sacrificial metal spacer damascene process Grant 6,846,741 - Cooney, III , et al. January 25, 2 | 2005-01-25 |
| Full Removal Of Dual Damascene Metal Level App 20040245636 - Cooney, Edward C III ; et al. | 2004-12-09 |
| Sacrificial Metal Liner For Copper App 20040150103 - Cooney, Edward C. III ; et al. | 2004-08-05 |
| Sacrificial metal liner for copper App 20040152295 - Cooney, Edward C. III ; et al. | 2004-08-05 |
| Single and multilevel rework App 20040142565 - Cooney, Edward C. III ; et al. | 2004-07-22 |
| Post-fuse blow corrosion prevention structure for copper fuses Grant 6,746,947 - Daubenspeck , et al. June 8, 2 | 2004-06-08 |
| Contact capping local interconnect App 20040021226 - Geffken, Robert M. ; et al. | 2004-02-05 |
| Sacrificial metal spacer damascene process App 20040018714 - Cooney, Edward C. III ; et al. | 2004-01-29 |
| Contact capping local interconnect Grant 6,680,514 - Geffken , et al. January 20, 2 | 2004-01-20 |
| Single and multilevel rework Grant 6,674,168 - Cooney, III , et al. January 6, 2 | 2004-01-06 |
| Metal spacer in single and dual damascene processing App 20040000721 - Cooney, Edward C. III ; et al. | 2004-01-01 |
| Post-fuse blow corrosion prevention structure for copper fuses App 20030116820 - Daubenspeck, Timothy H. ; et al. | 2003-06-26 |
| Integrated high-performance decoupling capacitor and heat sink Grant 6,548,338 - Bernstein , et al. April 15, 2 | 2003-04-15 |
| Post-fuse blow corrosion prevention structure for copper fuses Grant 6,498,385 - Daubenspeck , et al. December 24, 2 | 2002-12-24 |
| Damascene metal capacitor Grant 6,452,251 - Bernstein , et al. September 17, 2 | 2002-09-17 |
| Buried metal dual damascene plate capacitor Grant 6,426,249 - Geffken , et al. July 30, 2 | 2002-07-30 |
| Integrated high-performance decoupling capacitor and heat sink App 20010050408 - Bernstein, Kerry ; et al. | 2001-12-13 |
| Integrated high-performance decoupling capacitor and heat sink Grant 6,236,103 - Bernstein , et al. May 22, 2 | 2001-05-22 |
| Method of forming a self-aligned copper diffusion barrier in vias Grant 5,985,762 - Geffken , et al. November 16, 1 | 1999-11-16 |
| Antifuse structure Grant 5,811,870 - Bhattacharyya , et al. September 22, 1 | 1998-09-22 |
| Transverse diffusion barrier interconnect structure Grant 5,585,674 - Geffken , et al. December 17, 1 | 1996-12-17 |
| Method of forming transverse diffusion barrier interconnect structure Grant 5,488,013 - Geffken , et al. January 30, 1 | 1996-01-30 |
| Metallization composite having nickle intermediate/interface Grant 5,457,345 - Cook , et al. October 10, 1 | 1995-10-10 |
| Sidewall decoupling capacitor Grant 5,339,212 - Geffken , et al. August 16, 1 | 1994-08-16 |
| Plural level chip masking Grant 5,126,006 - Cronin , et al. June 30, 1 | 1992-06-30 |
| Method for forming dense multilevel interconnection metallurgy for semiconductor devices Grant 4,423,547 - Farrar , et al. January 3, 1 | 1984-01-03 |
| Method for making an insulated gate field effect transistor utilizing a silicon gate and silicide interconnection vias Grant 4,109,372 - Geffken August 29, 1 | 1978-08-29 |
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