Gealer; Charles A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gealer; Charles A..The latest application filed is for "mainboard assembly including a package overlying a die directly attached to the mainboard".

Company Profile

3.16.18

Gealer; Charles A. - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same Grant 11,217,516 - Muthukumar , et al. January 4, 2	2022-01-04
Mainboard assembly including a package overlying a die directly attached to the mainboard Grant 10,555,417 - Searls , et al. Fe	2020-02-04
Mainboard Assembly Including A Package Overlying A Die Directly Attached To The Mainboard App 20190182958 - SEARLS; Damion ; et al.	2019-06-13
Stacked-chip Packages In Package-on-package Apparatus, Methods Of Assembling Same, And Systems Containing Same App 20190148275 - MUTHUKUMAR; Sriram ; et al.	2019-05-16
Mainboard assembly including a package overlying a die directly attached to the mainboard Grant 10,251,273 - Searls , et al.	2019-04-02
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same Grant 10,186,480 - Muthukumar , et al. Ja	2019-01-22
High density interconnection of microelectronic devices Grant 9,842,832 - Karhade , et al. December 12, 2	2017-12-12
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips Grant 9,617,148 - Ma , et al. April 11, 2	2017-04-11
Tsv-connected Backside Decoupling App 20170012029 - LAMBERT; William J. ; et al.	2017-01-12
High Density Interconnection Of Microelectronic Devices App 20160300824 - Karhade; Omkar G. ; et al.	2016-10-13
Interposer For Hermetic Sealing Of Sensor Chips And For Their Integration With Integrated Circuit Chips App 20160280539 - MA; Qing ; et al.	2016-09-29
High density interconnection of microelectronic devices Grant 9,397,071 - Karhade , et al. July 19, 2	2016-07-19
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips Grant 9,368,429 - Ma , et al. June 14, 2	2016-06-14
Die Assembly On Thin Dielectric Sheet App 20160043056 - Chiu; Chia-Pin ; et al.	2016-02-11
Die assembly on thin dielectric sheet Grant 9,177,831 - Chiu , et al. November 3, 2	2015-11-03
High Density Interconnection Of Microelectronic Devices App 20150163904 - Karhade; Omkar G. ; et al.	2015-06-11
Die Assembly On Thin Dielectric Sheet App 20150091182 - Chiu; Chia-Pin ; et al.	2015-04-02
Interposer For Hermetic Sealing Of Sensor Chips And For Their Integration With Integrated Circuit Chips App 20130249109 - MA; Qing ; et al.	2013-09-26
Stacked-chip Packages In Package-on-package Apparatus, Methods Of Assembling Same, And Systems Containing Same App 20130127054 - MUTHUKUMAR; Sriram ; et al.	2013-05-23
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same App 20100327419 - Muthukumar; Sriram ; et al.	2010-12-30
Mainboard assembly including a package overlying a die directly attached to the mainboard App 20100061056 - Searls; Damion ; et al.	2010-03-11
Injection Molded Metal Ic Package Stiffener And Package-to-package Interconnect Frame App 20090321925 - Gealer; Charles A. ; et al.	2009-12-31
Electronic packages with dice landed on wire bonds Grant 7,166,924 - Lu , et al. January 23, 2	2007-01-23
Electronic packages with dice landed on wire bonds App 20060038273 - Lu; Jicun ; et al.	2006-02-23
Integrated circuit package overlay App 20050121757 - Gealer, Charles A.	2005-06-09
Direct BGA attachment without solder reflow Grant 6,750,551 - Frutschy , et al. June 15, 2	2004-06-15
Thermal interface thickness control for a microprocessor Grant 6,043,560 - Haley , et al. March 28, 2	2000-03-28

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