Ge; Yaping
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ge; Yaping.The latest application filed is for "flip chip bonding device and bonding method".
- Ge; Yaping - Shanghai CN
| Patent | Date |
|---|---|
| Exposure system, exposure device and exposure method Grant 10,942,458 - Lan , et al. March 9, 2 | 2021-03-09 |
| Flip chip bonding device and bonding method Grant 10,903,105 - Chen , et al. January 26, 2 | 2021-01-26 |
| Chip bonding apparatus and method Grant 10,748,800 - Zhu , et al. A | 2020-08-18 |
| Flip Chip Bonding Device And Bonding Method App 20200013656 - CHEN; Feibiao ; et al. | 2020-01-09 |
| Exposure System, Exposure Device And Exposure Method App 20190163074 - LAN; Ke ; et al. | 2019-05-30 |
| Chip Bonding Apparatus And Method App 20190088516 - ZHU; Yuebin ; et al. | 2019-03-21 |
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