| Patent | Date |
|---|
Chip package for two-phase cooling and assembly process thereof
Grant 10,607,963 - Brunschwiler , et al. | 2020-03-31 |
Underfill dispensing using funnels
Grant 10,249,516 - Colgan , et al. | 2019-04-02 |
Chip Package For Two-phase Cooling And Assembly Process Thereof
App 20180076113 - Brunschwiler; Thomas J. ; et al. | 2018-03-15 |
Underfill dispensing using funnels
Grant 9,852,960 - Colgan , et al. December 26, 2 | 2017-12-26 |
Underfill Dispensing Using Funnels
App 20170309538 - Colgan; Evan George ; et al. | 2017-10-26 |
Underfill Dispensing Using Funnels
App 20170271232 - Colgan; Evan George ; et al. | 2017-09-21 |
Precast thermal interface adhesive for easy and repeated, separation and remating
Grant 9,272,498 - Colgan , et al. March 1, 2 | 2016-03-01 |
Thermal Interface Material Application For Integrated Circuit Cooling
App 20130118008 - Gaynes; Michael Anthony ; et al. | 2013-05-16 |
Thermal interface material application for integrated circuit cooling
Grant 8,411,444 - Gaynes , et al. April 2, 2 | 2013-04-02 |
Precast Thermal Interface Adhesive For Easy And Repeated, Separation And Remating
App 20120276375 - Colgan; Evan George ; et al. | 2012-11-01 |
Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
Grant 7,808,781 - Colgan , et al. October 5, 2 | 2010-10-05 |
Apparatus and Methods for High-Performance Liquid Cooling of Multiple Chips with Disparate Cooling Requirements
App 20090284921 - Colgan; Evan George ; et al. | 2009-11-19 |
Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain
Grant 7,504,718 - Gaynes , et al. March 17, 2 | 2009-03-17 |
Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain
App 20060255442 - Gaynes; Michael Anthony ; et al. | 2006-11-16 |
Fluidic Cooling Systems And Methods For Electronic Components
App 20060104031 - Colgan; Evan George ; et al. | 2006-05-18 |
Printed wiring board interposer sub-assembly and method
Grant 6,974,915 - Brodsky , et al. December 13, 2 | 2005-12-13 |
Method of making an interposer sub-assembly in a printed wiring board
Grant 6,892,451 - Brodsky , et al. May 17, 2 | 2005-05-17 |
Method of making an interposer sub-assembly in a printed wiring board
App 20050064740 - Brodsky, William Louis ; et al. | 2005-03-24 |
Reworkable and thermally conductive adhesive and use thereof
Grant 6,777,817 - Buchwalter , et al. August 17, 2 | 2004-08-17 |
EMI shielding for semiconductor chip carriers
Grant 6,740,959 - Alcoe , et al. May 25, 2 | 2004-05-25 |
Reworkable and thermally conductive adhesive and use thereof
App 20040041280 - Buchwalter, Stephen L. ; et al. | 2004-03-04 |
Enhanced electrical/mechanical connection for electronic devices
Grant 6,695,623 - Brodsky , et al. February 24, 2 | 2004-02-24 |
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
Grant 6,670,223 - Gaynes , et al. December 30, 2 | 2003-12-30 |
Reworkable and thermally conductive adhesive and use thereof
Grant 6,617,698 - Buchwalter , et al. September 9, 2 | 2003-09-09 |
Method of making an interposer sub-assembly in a printed wiring board
App 20030116351 - Brodsky, William Louis ; et al. | 2003-06-26 |
Printed wiring board interposer sub-assembly
Grant 6,545,226 - Brodsky , et al. April 8, 2 | 2003-04-08 |
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
App 20030053297 - Gaynes, Michael Anthony ; et al. | 2003-03-20 |
EMI shielding for semiconductor chip carriers
App 20030025180 - Alcoe, David James ; et al. | 2003-02-06 |
Compliant multi-layered circuit board for PBGA applications
Grant 6,495,771 - Gaynes , et al. December 17, 2 | 2002-12-17 |
Printed wiring board interposer sub-assembly and method
App 20020179331 - Brodsky, William Louis ; et al. | 2002-12-05 |
Enhanced electrical/mechanical connection for electronic devices
App 20020182900 - Brodsky, William Louis ; et al. | 2002-12-05 |
Reworkable and thermally conductive adhesive and use thereof
App 20020171132 - Buchwalter, Stephen ; et al. | 2002-11-21 |
Compliant Multi-layered Circuit Board For Pbga Applications
App 20020139570 - Gaynes, Michael Anthony ; et al. | 2002-10-03 |
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
App 20020121694 - Gaynes, Michael Anthony ; et al. | 2002-09-05 |
Structure and method for reinforcing a semiconductor device to prevent cracking
App 20010009277 - Gaynes, Michael Anthony ; et al. | 2001-07-26 |
Attaching heat sinks directly to flip chips and ceramic chip carriers
Grant 6,251,707 - Bernier , et al. June 26, 2 | 2001-06-26 |
High density integrated circuit packaging with chip stacking and via interconnections
Grant 6,236,115 - Gaynes , et al. May 22, 2 | 2001-05-22 |
Method for reinforcing a semiconductor device to prevent cracking
Grant 6,197,619 - Gaynes , et al. March 6, 2 | 2001-03-06 |
Lead free conductive composites for electrical interconnections
Grant 6,197,222 - Saraf , et al. March 6, 2 | 2001-03-06 |
High density integrated circuit packaging with chip stacking and via interconnections
Grant 6,187,678 - Gaynes , et al. February 13, 2 | 2001-02-13 |
Method of making components with solder balls
Grant 6,165,885 - Gaynes , et al. December 26, 2 | 2000-12-26 |
Component carrier with raised bonding sites
Grant 6,150,726 - Feilchenfeld , et al. November 21, 2 | 2000-11-21 |
Reworkable thermoplastic encapsulant
Grant 6,111,323 - Carter , et al. August 29, 2 | 2000-08-29 |
Attaching heat sinks directly to flip chips and ceramic chip carriers
Grant 6,069,023 - Bernier , et al. May 30, 2 | 2000-05-30 |
High density integrated circuit packaging with chip stacking and via interconnections
Grant 6,002,177 - Gaynes , et al. December 14, 1 | 1999-12-14 |
Liquid crystal display tile interconnected to a tile carrier and method
Grant 5,875,011 - Pierson , et al. February 23, 1 | 1999-02-23 |
Attaching heat sinks directly to flip chips and ceramic chip carriers
Grant 5,847,929 - Bernier , et al. December 8, 1 | 1998-12-08 |
Selectively filled adhesives for semiconductor chip interconnection and encapsulation
Grant 5,813,870 - Gaynes , et al. September 29, 1 | 1998-09-29 |
Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy
Grant 5,785,799 - Culnane , et al. July 28, 1 | 1998-07-28 |
Method of making a component carrier
Grant 5,759,737 - Feilchenfeld , et al. June 2, 1 | 1998-06-02 |
Chip carrier modules with heat sinks attached by flexible-epoxy
Grant 5,744,863 - Culnane , et al. April 28, 1 | 1998-04-28 |
Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy
Grant 5,672,548 - Culnane , et al. September 30, 1 | 1997-09-30 |
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