Patent | Date |
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Thermal matching in semiconductor devices using heat distribution structures Grant 8,859,337 - Gaul , et al. October 14, 2 | 2014-10-14 |
Monolithic Integrated Capacitors For High-efficiency Power Converters App 20120256193 - Hebert; Francois ;   et al. | 2012-10-11 |
Thermal Matching In Semiconductor Devices Using Heat Distribution Structures App 20110141696 - Gaul; Stephen J. ;   et al. | 2011-06-16 |
Methods Of Forming A Thermal Conduction Region In A Semiconductor Structure And Structures Resulting Therefrom App 20110140232 - Gaul; Stephen J. ;   et al. | 2011-06-16 |
Radiation Hardened Device App 20100323487 - Gaul; Stephen J. ;   et al. | 2010-12-23 |
Radiation Hardened Device App 20100038726 - GAUL; Stephen J. ;   et al. | 2010-02-18 |
Usage of a buildcode to specify layout characteristics Grant 7,461,366 - Gaul December 2, 2 | 2008-12-02 |
Usage of a buildcode to specify layout characteristics App 20070118825 - Gaul; Stephen J. | 2007-05-24 |
Integrated circuit air bridge structures and methods of fabricating same Grant 6,492,705 - Begley , et al. December 10, 2 | 2002-12-10 |
Method of fabrication of surface mountable integrated circuits Grant 5,618,752 - Gaul April 8, 1 | 1997-04-08 |
Surface mountable integrated circuit with conductive vias Grant 5,608,264 - Gaul March 4, 1 | 1997-03-04 |
Silicon on diamond circuit structure Grant 5,561,303 - Schrantz , et al. October 1, 1 | 1996-10-01 |
Die separation method for silicon on diamond circuit structures Grant 5,552,345 - Schrantz , et al. September 3, 1 | 1996-09-03 |
Direct etch for thin film resistor using a hard mask Grant 5,547,896 - Linn , et al. August 20, 1 | 1996-08-20 |
Stress relief technique of removing oxide from surface of trench-patterned semiconductor-on-insulator structure Grant 5,270,265 - Hemmenway , et al. December 14, 1 | 1993-12-14 |
Method of fabricating SOI wafer with SiGe as an etchback film in a BESOI process Grant 5,240,876 - Gaul , et al. August 31, 1 | 1993-08-31 |
SOI wafer with sige Grant 5,218,213 - Gaul , et al. June 8, 1 | 1993-06-08 |
Method of forming island with polysilicon-filled trench isolation Grant 5,217,919 - Gaul , et al. June 8, 1 | 1993-06-08 |
Ultra-thin circuit fabrication by controlled wafer debonding Grant 5,091,331 - Delgado , et al. February 25, 1 | 1992-02-25 |
Method of fabricating back diffused bonded oxide substrates Grant 4,968,628 - Delgado , et al. November 6, 1 | 1990-11-06 |
Integrated circuits including photo-optical devices and pressure transducers and method of fabrication Grant 4,916,497 - Gaul , et al. April 10, 1 | 1990-04-10 |