GAUDENZI, GENE J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for GAUDENZI, GENE J..The latest application filed is for "flip chip attach on flexible circuit carrier using chip with metallic cap on solder".

Company Profile

0.9.1

GAUDENZI, GENE J. - NORTH SALEM NY
Gaudenzi; Gene J. - Purdys NY
Gaudenzi; Gene J. - Purdy's NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flip Chip Attach On Flexible Circuit Carrier Using Chip With Metallic Cap On Solder App 20010013423 - DALAL, HORMAZDYAR M. ; et al.	2001-08-16
Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder Grant 5,729,896 - Dalal , et al. March 24, 1	1998-03-24
Method for making direct chip attach circuit card Grant 5,634,268 - Dalal , et al. June 3, 1	1997-06-03
Temperature controlled multi-layer module Grant 5,539,186 - Abrami , et al. July 23, 1	1996-07-23
Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array Grant 5,490,040 - Gaudenzi , et al. February 6, 1	1996-02-06
ECC function with self-contained high performance partial write or read/modify/write and parity look-ahead interface scheme Grant 5,313,475 - Cromer , et al. May 17, 1	1994-05-17
Direct chip attach module (DCAM) Grant 5,313,366 - Gaudenzi , et al. May 17, 1	1994-05-17
Bidirectional buffer with latch and parity capability Grant 5,173,619 - Gaudenzi , et al. December 22, 1	1992-12-22
Programmable voltage controlled ring oscillator Grant 4,978,927 - Hausman , et al. December 18, 1	1990-12-18
Small signal swing driver circuit Grant 4,682,050 - Beranger , et al. July 21, 1	1987-07-21

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