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Gau; Jy-Jie Patent Filings

Gau; Jy-Jie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gau; Jy-Jie.The latest application filed is for "non-vertical through-via in package".

Company Profile
3.5.5
  • Gau; Jy-Jie - Hsinchu TW
  • Gau; Jy-Jie - Hsin-Chu TW
  • Gau; Jy-Jie - Taipei TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Non-vertical through-via in package
Grant 11,355,406 - Huang , et al. June 7, 2
2022-06-07
Non-Vertical Through-via in Package
App 20200303275 - Huang; Cheng-Lin ;   et al.
2020-09-24
Non-vertical through-via in package
Grant 10,699,981 - Huang , et al.
2020-06-30
Non-Vertical Through-via in Package
App 20190067146 - Huang; Cheng-Lin ;   et al.
2019-02-28
Non-vertical through-via in package
Grant 10,115,647 - Huang , et al. October 30, 2
2018-10-30
Non-vertical Through-via In Package
App 20160276248 - Huang; Cheng-Lin ;   et al.
2016-09-22
Bump structures for semiconductor package
Grant 9,343,419 - Yu , et al. May 17, 2
2016-05-17
Bump Structures For Semiconductor Package
App 20140167254 - Yu; Chen-Hua ;   et al.
2014-06-19
Maintaining photoresist planarity at hole edges
Grant 7,005,236 - Cheng , et al. February 28, 2
2006-02-28
Maintaining photoresist planarity at hole edges
App 20040214112 - Cheng, Su-Jen ;   et al.
2004-10-28

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