Gaschke; Paul M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gaschke; Paul M..The latest application filed is for "high power cobra interposer wtih integrated guard plate".

Company Profile

0.10.5

Gaschke; Paul M. - Wappingers Falls NY
Gaschke, Paul M - Wappingers Falls NY
Gaschke; Paul M. - Wappinger Falls NY
Gaschke; Paul M. - Pleasantville NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Power Cobra Interposer Wtih Integrated Guard Plate App 20080143357 - Gaschke; Paul M. ; et al.	2008-06-19
Apparatus for temporary thermal coupling of an electronic device to a heat sink during test Grant 7,332,927 - Aube , et al. February 19, 2	2008-02-19
Apparatus For Temporary Thermal Coupling Of An Electronic Device To A Heat Sink During Test App 20070285116 - Aube; Paul J. ; et al.	2007-12-13
Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test Grant 7,259,580 - Aube , et al. August 21, 2	2007-08-21
Method And Apparatus For Temporary Thermal Coupling Of An Electronic Device To A Heat Sink During Test App 20060186909 - Aube; Paul J. ; et al.	2006-08-24
High power space transformer Grant 6,967,556 - Gaschke , et al. November 22, 2	2005-11-22
High Power Space Transformer App 20040263304 - Gaschke, Paul M ; et al.	2004-12-30
Off-axis contact tip and dense packing design for a fine pitch probe Grant 6,411,112 - Das , et al. June 25, 2	2002-06-25
Segmented architecture for wafer test & burn-in App 20010050567 - Bachelder, Thomas W. ; et al.	2001-12-13
Segmented architecture for wafer test and burn-in Grant 6,275,051 - Bachelder , et al. August 14, 2	2001-08-14
Vertical probe housing Grant 6,196,866 - Gaschke March 6, 2	2001-03-06
Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing Grant 6,086,387 - Gallagher , et al. July 11, 2	2000-07-11
Liquid film interface cooling chuck for semiconductor wafer processing Grant 5,186,238 - del Puerto , et al. February 16, 1	1993-02-16
Liquid film interface cooling system for semiconductor wafer processing Grant 5,088,006 - del Puerto , et al. February 11, 1	1992-02-11
Dry interface thermal chuck temperature control system for semiconductor wafer testing Grant 5,001,423 - Abrami , et al. March 19, 1	1991-03-19

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