GARUDA TECHNOLOGY CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for GARUDA TECHNOLOGY CO., LTD..The latest application filed is for "circuit board".

Company Profile

4.28.9

GARUDA TECHNOLOGY CO., LTD. - New Taipei TW
GARUDA TECHNOLOGY CO., LTD - New Taipei TW
GARUDA TECHNOLOGY CO., LTD. - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible circuit board and method for manufacturing same Grant 11,445,618 - Li , et al. September 13, 2	2022-09-13
Circuit Board App 20220279647 - WU; WEI-LIANG ; et al.	2022-09-01
Board-to-board connecting structure and method for manufacturing the same Grant 11,424,563 - Zheng , et al. August 23, 2	2022-08-23
Method for manufacturing circuit board Grant 11,399,430 - Wu , et al. July 26, 2	2022-07-26
Circuit Board With At Least One Embedded Electronic Component And Method For Manufacturing The Same App 20220232697 - WEI; YONG-CHAO	2022-07-21
Clothing-type Wearable Fabric Capable Of Adjusting Temperature Thereof App 20220218048 - HSU; MAO-FENG	2022-07-14
Method For Manufacturing Circuit Board App 20220174813 - WU; WEI-LIANG ; et al.	2022-06-02
Circuit Board With At Least One Embedded Electronic Component And Method For Manufacturing The Same App 20220167500 - WEI; YONG-CHAO	2022-05-26
Board-to-board Connecting Structure And Method For Manufacturing The Same App 20220140508 - ZHENG; XIAO-FENG ; et al.	2022-05-05
Circuit board with at least one embedded electronic component and method for manufacturing the same Grant 11,324,115 - Wei May 3, 2	2022-05-03
Method for manufacturing an ultrathin heat dissipation structure Grant 10,923,411 - Hou , et al. February 16, 2	2021-02-16
Method For Manufacturing An Ultrathin Heat Dissipation Structure App 20190320550 - HOU; NING ; et al.	2019-10-17
Ultrathin heat dissipation structure Grant 10,448,540 - Hou , et al. Oc	2019-10-15
Flexible printed circuit board and method for manufacturing same Grant 10,285,260 - Hu , et al.	2019-05-07
Heat dissipation device and method for manufacturing same Grant 10,012,454 - Hu , et al. July 3, 2	2018-07-03
Printed circuit board Grant 9,992,858 - Ho , et al. June 5, 2	2018-06-05
Method for making a circuit board Grant 9,872,393 - Yeh January 16, 2	2018-01-16
Printed Circuit Board App 20170367191 - SU; WEI-SHUO	2017-12-21
Circuit board and method for making the same Grant 9,832,888 - Li , et al. November 28, 2	2017-11-28
Printed circuit board and method for manufacturing same Grant 9,820,388 - Ho , et al. November 14, 2	2017-11-14
Method for manufacturing printed circuit board with etching process to partially remove conductive layer Grant 9,788,437 - Su October 10, 2	2017-10-10
Printed Circuit Board App 20170265295 - HO; MING-JAAN ; et al.	2017-09-14
Method for manufacturing rigid-flexible printed circuit board Grant 9,743,533 - Tsai August 22, 2	2017-08-22
Flexible circuit board and method for making the same Grant 9,693,448 - Hu , et al. June 27, 2	2017-06-27
Flexible circuit board and method for manufacturing same Grant 9,622,340 - Hu , et al. April 11, 2	2017-04-11
Flexible circuit board and method for manufacturing same Grant 9,615,445 - Hu , et al. April 4, 2	2017-04-04

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