| Patent | Date |
|---|
Machine Learning For Classifying Retaining Rings
App 20220281052 - Lau; Eric ; et al. | 2022-09-08 |
Control Of Processing Parameters For Substrate Polishing With Substrate Precession
App 20220283554 - Lau; Eric ; et al. | 2022-09-08 |
Control Of Processing Parameters For Substrate Polishing With Angularly Distributed Zones Using Cost Function
App 20220281053 - Lau; Eric ; et al. | 2022-09-08 |
Retaining ring design
Grant 11,400,560 - Oh , et al. August 2, 2 | 2022-08-02 |
Asymmetry Correction Via Oriented Wafer Loading
App 20220208621 - Lau; Eric ; et al. | 2022-06-30 |
Retaining Ring With Shaped Surface And Method Of Forming
App 20220152778 - Chen; Hung Chih ; et al. | 2022-05-19 |
Polishing Head With Local Wafer Pressure
App 20220143779 - NAGENGAST; Andrew ; et al. | 2022-05-12 |
Asymmetry correction via oriented wafer loading
Grant 11,282,755 - Lau , et al. March 22, 2 | 2022-03-22 |
Retaining ring with shaped surface
Grant 11,260,500 - Chen , et al. March 1, 2 | 2022-03-01 |
Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
Grant 11,241,769 - Ishikawa , et al. February 8, 2 | 2022-02-08 |
Asymmetry Correction Via Oriented Wafer Loading
App 20210066142 - Lau; Eric ; et al. | 2021-03-04 |
Retaining Ring with Shaped Surface
App 20200398399 - Chen; Hung Chih ; et al. | 2020-12-24 |
Spiral And Concentric Movement Designed For Cmp Location Specific Polish (lsp)
App 20200282506 - LAU; Eric ; et al. | 2020-09-10 |
Retaining ring with shaped surface
Grant 10,766,117 - Chen , et al. Sep | 2020-09-08 |
Polishing system with local area rate control and oscillation mode
Grant 10,610,994 - Lau , et al. | 2020-04-07 |
Textured small pad for chemical mechanical polishing
Grant 10,589,399 - Oh , et al. | 2020-03-17 |
Local area polishing system and polishing pad assemblies for a polishing system
Grant 10,434,623 - Lau , et al. O | 2019-10-08 |
Methods And Apparatus For Profile And Surface Preparation Of Retaining Rings Utilized In Chemical Mechanical Polishing Processes
App 20190105754 - ISHIKAWA; David Masayuki ; et al. | 2019-04-11 |
Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
Grant 10,252,397 - Ishikawa , et al. | 2019-04-09 |
Chemical mechanical polishing automated recipe generation
Grant 10,256,111 - Lau , et al. | 2019-04-09 |
Retaining Ring Design
App 20190099857 - OH; Jeonghoon ; et al. | 2019-04-04 |
Spiral And Concentric Movement Designed For Cmp Location Specific Polish (lsp)
App 20180250788 - LAU; Eric ; et al. | 2018-09-06 |
Retaining Ring With Shaped Surface
App 20180185979 - Chen; Hung Chih ; et al. | 2018-07-05 |
Retaining ring with Shaped Surface
Grant 9,937,601 - Chen , et al. April 10, 2 | 2018-04-10 |
Chemical Mechanical Polishing Automated Recipe Generation
App 20180005842 - LAU; Eric ; et al. | 2018-01-04 |
Polishing System With Local Area Rate Control And Oscillation Mode
App 20170274495 - LAU; Eric ; et al. | 2017-09-28 |
Local Area Polishing System And Polishing Pad Assemblies For A Polishing System
App 20170274497 - LAU; Eric ; et al. | 2017-09-28 |
Textured Small Pad For Chemical Mechanical Polishing
App 20170274498 - Oh; Jeonghoon ; et al. | 2017-09-28 |
Methods And Apparatus For Profile And Surface Preparation Of Retaining Rings Utilized In Chemical Mechanical Polishing Processes
App 20160121453 - ISHIKAWA; David Masayuki ; et al. | 2016-05-05 |
Retaining Ring With Shaped Surface
App 20160045997 - Chen; Hung Chih ; et al. | 2016-02-18 |
Dynamic residue clearing control with in-situ profile control (ISPC)
Grant 9,242,337 - Qian , et al. January 26, 2 | 2016-01-26 |
Retaining ring with shaped surface
Grant 9,186,773 - Chen , et al. November 17, 2 | 2015-11-17 |
Closed-loop control for improved polishing pad profiles
Grant 9,138,860 - Dhandapani , et al. September 22, 2 | 2015-09-22 |
Retaining ring monitoring and control of pressure
Grant 9,017,138 - Chen , et al. April 28, 2 | 2015-04-28 |
Dynamic Residue Clearing Control With In-situ Profile Control (ispc)
App 20140273749 - QIAN; Jun ; et al. | 2014-09-18 |
Method for compensation of variability in chemical mechanical polishing consumables
Grant 8,758,085 - Dhandapani , et al. June 24, 2 | 2014-06-24 |
Feedback for polishing rate correction in chemical mechanical polishing
Grant 8,755,927 - Qian , et al. June 17, 2 | 2014-06-17 |
Retaining Ring With Shaped Surface
App 20140053981 - Chen; Hung Chih ; et al. | 2014-02-27 |
Retaining ring with shaped surface
Grant 8,585,468 - Chen , et al. November 19, 2 | 2013-11-19 |
Feedback For Polishing Rate Correction In Chemical Mechanical Polishing
App 20130273812 - Qian; Jun ; et al. | 2013-10-17 |
Retaining Ring Monitoring And Control Of Pressure
App 20130203321 - Chen; Hung Chih ; et al. | 2013-08-08 |
Feedback for polishing rate correction in chemical mechanical polishing
Grant 8,467,896 - Qian , et al. June 18, 2 | 2013-06-18 |
Pad Conditioning Force Modeling To Achieve Constant Removal Rate
App 20130122783 - Menk; Gregory E. ; et al. | 2013-05-16 |
Closed-loop control for effective pad conditioning
Grant 8,337,279 - Dhandapani , et al. December 25, 2 | 2012-12-25 |
Feedback For Polishing Rate Correction In Chemical Mechanical Polishing
App 20120231701 - Qian; Jun ; et al. | 2012-09-13 |
Feedback for polishing rate correction in chemical mechanical polishing
Grant 8,190,285 - Qian , et al. May 29, 2 | 2012-05-29 |
Apparatus And Method For Compensation Of Variability In Chemical Mechanical Polishing Consumables
App 20120100779 - Dhandapani; Sivakumar ; et al. | 2012-04-26 |
Retaining Ring With Shaped Surface
App 20120071067 - Chen; Hung Chih ; et al. | 2012-03-22 |
Retaining ring with shaped surface
Grant 8,066,551 - Chen , et al. November 29, 2 | 2011-11-29 |
Feedback For Polishing Rate Correction In Chemical Mechanical Polishing
App 20110281501 - Qian; Jun ; et al. | 2011-11-17 |
Closed-loop Control For Improved Polishing Pad Profiles
App 20110256812 - Dhandapani; Sivakumar ; et al. | 2011-10-20 |
Retaining Ring With Shaped Surface
App 20110195639 - Chen; Hung Chih ; et al. | 2011-08-11 |
Retaining ring with shaped surface
Grant 7,927,190 - Chen , et al. April 19, 2 | 2011-04-19 |
Closed-loop Control For Effective Pad Conditioning
App 20090318060 - Dhandapani; Sivakumar ; et al. | 2009-12-24 |
Retaining Ring With Shaped Surface
App 20080196833 - Chen; Hung Chih ; et al. | 2008-08-21 |
Retaining ring with shaped surface
Grant 7,344,434 - Chen , et al. March 18, 2 | 2008-03-18 |
Profile control platen
Grant 7,115,024 - Chen , et al. October 3, 2 | 2006-10-03 |
Retaining ring with shaped surface
App 20050191947 - Chen, Hung Chih ; et al. | 2005-09-01 |
Profile control platen
App 20050186892 - Chen, Hung Chih ; et al. | 2005-08-25 |
Profile control platen
Grant 6,913,518 - Chen , et al. July 5, 2 | 2005-07-05 |
Carrier head with a modified flexible membrane
Grant 6,855,043 - Tang , et al. February 15, 2 | 2005-02-15 |
Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
Grant 6,855,031 - Fuksshimov , et al. February 15, 2 | 2005-02-15 |
Profile control platen
App 20040224615 - Chen, Hung Chih ; et al. | 2004-11-11 |
Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
App 20030166378 - Fuksshimov, Boris ; et al. | 2003-09-04 |
Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane
Grant 6,572,446 - Osterheld , et al. June 3, 2 | 2003-06-03 |
Pad conditioning disk
Grant 6,551,176 - Garretson April 22, 2 | 2003-04-22 |
Method of post CMP defect stability improvement
Grant 6,220,941 - Fishkin , et al. April 24, 2 | 2001-04-24 |
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