| Patent | Date |
|---|
Method to form a via
Grant 8,586,474 - Chatterjee , et al. November 19, 2 | 2013-11-19 |
Method of making a semiconductor device including a bridgeable material
Grant 8,168,468 - Mathew , et al. May 1, 2 | 2012-05-01 |
Method for forming interconnects for 3-D applications
Grant 8,003,517 - Mathew , et al. August 23, 2 | 2011-08-23 |
Method To Form A Via
App 20110151663 - Chatterjee; Ritwik ; et al. | 2011-06-23 |
Method to form a via
Grant 7,932,175 - Chatterjee , et al. April 26, 2 | 2011-04-26 |
Micropad formation for a semiconductor
Grant 7,807,572 - Mathew , et al. October 5, 2 | 2010-10-05 |
Conductive Bridge Random Access Memory Device And Method Of Making The Same
App 20090218567 - Mathew; Varughese ; et al. | 2009-09-03 |
Micropad for bonding and a method therefor
Grant 7,572,723 - Mathew , et al. August 11, 2 | 2009-08-11 |
Micropad Formation For A Semiconductor
App 20090176366 - Mathew; Varughese ; et al. | 2009-07-09 |
Method for forming interconnects for 3-D applications
App 20080299762 - Mathew; Varughese ; et al. | 2008-12-04 |
Method to form a via
App 20080299759 - Chatterjee; Ritwik ; et al. | 2008-12-04 |
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof
Grant 7,422,979 - Michaelson , et al. September 9, 2 | 2008-09-09 |
Method for cleaning electroless process tank
Grant 7,410,544 - Garcia , et al. August 12, 2 | 2008-08-12 |
Micropad For Bonding And A Method Therefor
App 20080099799 - Mathew; Varughese ; et al. | 2008-05-01 |
Method for cleaning electroless process tank
App 20070246075 - Garcia; Sam S. ; et al. | 2007-10-25 |
Method for forming a capping layer on a semiconductor device
App 20070049008 - Martin; Gerald A. ; et al. | 2007-03-01 |
Method and composition for preparing a semiconductor surface for deposition of a barrier material
App 20060270234 - Mathew; Varughese ; et al. | 2006-11-30 |
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof
App 20060202339 - Michaelson; Lynne M. ; et al. | 2006-09-14 |
Method for forming a fully silicided semiconductor device
App 20050266664 - Harrison, Michael G. ; et al. | 2005-12-01 |
Semiconductor process and composition for forming a barrier material overlying copper
Grant 6,924,232 - Mathew , et al. August 2, 2 | 2005-08-02 |
Semiconductor process and composition for forming a barrier material overlying copper
App 20050048773 - Mathew, Varughese ; et al. | 2005-03-03 |
Method of making an inlaid structure in a semiconductor device
App 20030134504 - Denning, Dean J. ; et al. | 2003-07-17 |
Method for forming a barrier layer for use in a copper interconnect
App 20020092763 - Denning, Dean J. ; et al. | 2002-07-18 |
Semiconductor device adhesive layer structure and process for forming structure
Grant 6,294,458 - Zhang , et al. September 25, 2 | 2001-09-25 |
Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material
Grant 6,187,682 - Denning , et al. February 13, 2 | 2001-02-13 |
Semiconductor device with a copper barrier layer and formation thereof
Grant 6,093,966 - Venkatraman , et al. July 25, 2 | 2000-07-25 |
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