Garando; Lahcen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Garando; Lahcen.The latest application filed is for "method and packages to protect electronics components in a subterranean environment".
- Garando; Lahcen - Orsay FR
| Patent | Date |
|---|---|
| Multi chip modules for downhole equipment Grant 9,379,052 - Barbara , et al. June 28, 2 | 2016-06-28 |
| Downhole tool thermal device Grant 9,097,088 - Takeda , et al. August 4, 2 | 2015-08-04 |
| Method and Packages to Protect Electronics Components in a Subterranean Environment App 20150000933 - Parry; Andrew J. ; et al. | 2015-01-01 |
| Contact-less sensor cartridge Grant 8,695,415 - Veneruso , et al. April 15, 2 | 2014-04-15 |
| Multi Chip Modules for Downhole Equipment App 20130105140 - Barbara; Francois ; et al. | 2013-05-02 |
| Downhole Tool Thermal Device App 20120152545 - TAKEDA; JIRO ; et al. | 2012-06-21 |
| Contact-less Sensor Cartridge App 20100011853 - Anthony; Veneruso ; et al. | 2010-01-21 |
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