Gannamani; Ranjit
Patent Applications and Registrations
Patent applications and USPTO patent grants for Gannamani; Ranjit.The latest application filed is for "reliability aware thermal design".
- Gannamani; Ranjit - San Jose CA
| Patent | Date |
|---|---|
| Reliability aware thermal design Grant 9,495,491 - Maitra , et al. November 15, 2 | 2016-11-15 |
| Reliability Aware Thermal Design App 20150261901 - Maitra; Kingsuk ; et al. | 2015-09-17 |
| Semiconductor device having a filled trench structure and methods for fabricating the same Grant 8,174,131 - Zhang , et al. May 8, 2 | 2012-05-08 |
| Semiconductor chip with solder joint protection ring Grant 7,923,850 - Khan , et al. April 12, 2 | 2011-04-12 |
| Semiconductor Device Having A Filled Trench Structure And Methods For Fabricating The Same App 20100301460 - ZHANG; Zhen ; et al. | 2010-12-02 |
| Semiconductor chip with stratified underfill Grant 7,745,264 - Zhai , et al. June 29, 2 | 2010-06-29 |
| Semiconductor Chip with Solder Joint Protection Ring App 20100052188 - Khan; Mohammad ; et al. | 2010-03-04 |
| Solder Interconnect App 20100015762 - Khan; Mohammad ; et al. | 2010-01-21 |
| Semiconductor Chip with Stratified Underfill App 20090057928 - Zhai; Jun ; et al. | 2009-03-05 |
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